Thermal conductivity with Pana-Tetra
Pana-Tetra has a thermal conductivity (about 25W/m・K) Rubber and the resin which compounded in Pana-Tetra can be gotten superior materials in heat conductivity and , radiation of heat characteristics by effective heat conduction pass formation mechanism.
Conduction pass formation mechanism by Pana-Tetra
Because Pana-Tetra is three-dimensional tetrapod shape, heat conduction passes formation is better in comparison with the granular filler. In addition, heat conduction characteristic is stable by using Pana-Tetratogether with a filler in granular filler and fiber.
BASE RESIN：PPS RESIN Thickness 3mm
BASE RESIN：PA6 RESIN
BASE RESIN：Silicon SHEET Thickness 2mm
BASE RESIN：EPDM RUBBER Thickness 2mm