Features:POSCAP

Features

Lead free
Terminal plating is Palladium and Gold. It's completely lead free.
Low profile chip capacitor
 
Low impedance and low ESR at high frequency
 
High ripple current capability
 
Long Life 105°C*2,000Hrs*
 
Excellent noise-absorbent characteristics
 
Excellent temperature characteristics up to .55°C
 
The rush current is guaranteed for 20A
 
Superior to Ta-Cap in safety
 

*A part of the model is excluded.

↑Back to top

Measures against problems with electrolytic capacitors and general tantalum capacitors

  1. Noise measure
  2. Ignition measure
  3. Low profile / Space-saving

Conductive products can solve the problem

1. Noise Noise measure

  • General tantalum
    aluminum electrolytic capacitors
    High ripple by high ESR
  • General tantalum/aluminum electrolytic capacitors graph
  • yajirushi_migi
  • Ripple content image
  • Conductivity
    Low ripple by low ESR
  • Conductivity graph

2. Safety(compared to general tantalum capacitors) Ignition measure

  • Overvoltage test General tantalum capacitors
  • Overvoltage test General tantalum capacitors image
  • Ignition by overvoltage
  • 右向き矢じるし
  • Overvoltage test Conductive capacitors
  • Overvoltage test Conductive capacitors image
  • Safety with self-recovery function

3. Space Low profile Space-saving

  • ■Low profile
  • aluminum electrolytic capacitors picture
  • aluminum electrolytic capacitors
  • aluminum electrolytic capacitors image
  • 右向き矢じるし
  • SP-Cap/POSCAP picture
  • SP-Cap / POSCAP
  • SP-Cap/POSCAP image
■Space-saving(Reduced space by 70%)
  • General tantalum
  • General tantalum picture
  • 右向き矢じるし
  • SP-Cap / POSCAP
  • SP-Cap/POSCAP picture

↑Back to top

Measures against problems in ceramic capacitors (MLCC)

  1. Quantity/Cost reduction
  2. Rudeness prevention / Anti-vibration
  3. Crack prevention measures
  4. Safety measure

Conductive products can solve the problem

1. Insufficient capacitance Quantity/Cost reduction

  • Capacitance of MLCC is reduced by Voltage application + Low temperature/High temperature
  • Capacitance of MLCC is reduced by Voltage application + Low temperature/High temperature
  • Quantity of MLCC and SP-cap/POSCAP

2. Squeaking / Micro vibration Rudeness prevention Anti-vibration

  • SP-Cap/POSCAP Rudeness prevention Anti-vibration
  • MLCC
    Expansion and contraction of
    element by Piezo effect
    (Generation of micro vibrations)

    SP-Cap / POSCAP
    No vibration
  • generation of squeals image

3. Cracks Crack prevention measure

  • MLCC is cracked by temperature/mechanical impact
  • MLCC is cracked by temperature/mechanical impact image

4. Fire spreading to board Safety measure

The red heat continues if MLCC is short-circuited.

  • MLCC
    MLCC picture
  • 右向き矢じるし
  • MLCC red heat picture
  • 右向き矢じるし
  • Fire broadly spread to the board around MLCC
    Fire broadly spread to the board around MLCC
  • SP-Cap
    SP-Cap picture
  • 右向き矢じるし
  • No red heat
  • 右向き矢じるし
  • SP-Cap/POSCAP swells or burns, but less spreading of fire
    SP-Cap/POSCAP swells or burns, but less spreading of fire

↑Back to top