R-5515/R-5410 : High frequency circuit board materials for wireless/RF applications "XPEDION"series

High frequency circuit board materials for wireless/RF applications "XPEDION"series

Halogen-free Ultra-low transmission loss Multi-layer Circuit board materials XPEDION1

Parts no

Item Performance characteristics
Glass transition temp.(Tg) :DSC -
Glass transition temp.(Tg) :TMA (°C) 170
Glass transition temp.(Tg) :DMA (°C) 200
Thermal decomposition temp.(Td):TGA (°C) 410
Time to delam(T288)Without Cu:IPC-TM-650 (min) (>120)
Time to delam(T288)With Cu:IPC-TM-650 (min) (>120)
CTE:α1,X-axis,IPC-TM-650 2.4.24 (ppm/°C) 19-21
CTE:α1,Y-axis,IPC-TM-650 2.4.24 (ppm/°C) 19-21
CTE:α1,Z-axis,IPC-TM-650 2.4.24 (ppm/°C) (50)
CTE:α2,Z-axis,IPC-TM-650 2.4.24 (ppm/°C) (300)
Thermal conductivity:Laser flash,25˚C (W/m·K) (0.35)
Volume resistivity:IPC-TM-650,C-96/35/90 (MΩ·cm) (1 x 10⁹)
Surface resistivity:IPC-TM-650,C-96/35/90 (MΩ) (1 x 10⁸)
Dielectric constant(Dk)@1GHz:IPC-TM-650,C-24/23/50 -
Dielectric constant(Dk)@10GHz:IPC-TM-650,C-24/23/50 -
Dielectric constant(Dk)@10GHz:IPC-TM-650,C-24/23/50
Test method: Cavity resonance
Dielectric constant(Dk)@12GHz:Balanced-type circular disk resonator,C-24/23/50 -
Dielectric constant(Dk)@14GHz:Balanced-type circular disk resonator,C-24/23/50 3.06
Dissipation factor(Df )@1GHz:IPC-TM-650,C-24/23/50 -
Dissipation factor(Df )@10GHz:IPC-TM-650,C-24/23/50 -
Dissipation factor(Df )@10GHz:IPC-TM-650,C-24/23/50
Test method: Cavity resonance
Dissipation factor(Df )@12GHz:Balanced-type circular disk resonator,C-24/23/50 -
Dissipation factor(Df )@14GHz:Balanced-type circular disk resonator,C-24/23/50 0.002
Water absorption:IPC-TM-650,D-24/23 (%) 0.19
Flexural modulus,Warp/MD:JIS C 6481 (GPa) 9.3
Flexural modulus,Fill/TD:JIS C 6481 (GPa) 10
Peel strength,1oz:IPC-TM-650 2.4.8 (kN/m (lb/inch)) 0.6(3.4)
(Cu:H-VLP2 Hoz)
Flammability:UL,C-48/23/50 94V-0
The sample thickness 0.13mm
The above data are typical values and not guaranteed values. -
*1 Test method: TMA -