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High frequency circuit board materials for wireless/RF applications "XPEDION"series : Models

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Datasheet		 Series/Type Glass transition temp.(Tg) :DSC Glass transition temp.(Tg) :TMA
(°C) 		Glass transition temp.(Tg) :DMA
(°C) 		Thermal decomposition temp.(Td):TGA
(°C) 		Dielectric constant(Dk)@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 Dielectric constant(Dk)@10GHz:IPC-TM-650 2.5.5.5,C-24/23/50 Dielectric constant(Dk)@10GHz:IPC-TM-650 2.5.5.5,C-24/23/50
Test method: Cavity resonance 		Dielectric constant(Dk)@12GHz:Balanced-type circular disk resonator,C-24/23/50 Dielectric constant(Dk)@14GHz:Balanced-type circular disk resonator,C-24/23/50 Dissipation factor(Df )@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 Dissipation factor(Df )@10GHz:IPC-TM-650 2.5.5.5,C-24/23/50 Dissipation factor(Df )@10GHz:IPC-TM-650 2.5.5.5,C-24/23/50
Test method: Cavity resonance 		Dissipation factor(Df )@12GHz:Balanced-type circular disk resonator,C-24/23/50 Dissipation factor(Df )@14GHz:Balanced-type circular disk resonator,C-24/23/50 Time to delam(T288)Without Cu:IPC-TM-650 2.4.24.1
(min)		 Time to delam(T288)With Cu:IPC-TM-650 2.4.24.1
(min)		 CTE:α1,X-axis,IPC-TM-650 2.4.24
(ppm/°C)		 CTE:α1,Y-axis,IPC-TM-650 2.4.24
(ppm/°C)		 CTE:α1,Z-axis,IPC-TM-650 2.4.24
(ppm/°C)		 CTE:α2,Z-axis,IPC-TM-650 2.4.24
(ppm/°C)		 Thermal conductivity:Laser flash,25˚C
(W/m·K)		 Volume resistivity:IPC-TM-650 2.5.17.1,C-96/35/90
(MΩ·cm)		 Surface resistivity:IPC-TM-650 2.5.17.1,C-96/35/90
(MΩ)		 Water absorption:IPC-TM-650 2.6.2.1,D-24/23
(%)		 Flexural modulus,Warp/MD:JIS C 6481
(GPa)		 Flexural modulus,Fill/TD:JIS C 6481
(GPa)		 Peel strength,1oz:IPC-TM-650 2.4.8
(kN/m (lb/inch))		 Flammability:UL,C-48/23/50 The sample thickness The above data are typical values and not guaranteed values. *1 Test method: TMA
R-5515/R-5410
 Halogen-free Ultra-low transmission loss Multi-layer Circuit board materials XPEDION1 - 170 200 410 - - - - 3.06 - - - - 0.002 (>120) (>120) 19-21 19-21 (50) (300) (0.35) (1 x 10⁹) (1 x 10⁸) 0.19 9.3 10 0.6(3.4)
(Cu:H-VLP2 Hoz)		 94V-0 0.13mm
(0.50mm)		 - -
R-5575/R-5470
 High thermal conductivity Low transmission loss Halogen-free Multi-layer circuit board materials XPEDION T1 - 205 245 440 - - 3.6 - - - - 0.005 - - >120 >120 13-16 13-16 20 155 0.6 1 x 10⁹ 1 x 10⁸ 0.23 - - 0.8(4.6)
(Cu:RT)		 94V-0 0.5mm - -
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