Low stress Low CTE Ultra-thin IC substrate materials | R-G525T , R-G525F

Low warpage circuit board materials MEGTRON GX R-G525


  1. Realize low warpage at several type of IC package by low stress property

Circuit Board Materials

  • Part Number

Low CTE glass cloth

Laminate R-G525T
Prepreg R-G520T

Normal glass cloth

Laminate R-G525F
Prepreg R-G520F

  • Application
IC substrate
IC substrate

New branding announcement

  • Panasonic Electronic Materials Division launches a new product brand for the Semiconductor Device Materials business.
    The LEXCM brand now comprises all of the Semiconductor Device Materials; IC packaging materials (which includes substrates, encapsulants and underfills) and electronic assembly materials.
    Additionally, the IC substrate materials' brand is transitioning from MEGTRON GX to LEXCM GX.


Low Stress
CTE x, y-axis
Tg (DMA)

IC packages warpage

IC packages warpage

General properties

Item Test method Condition Unit LEXCM GX
Low CTE glass cloth
Normal glass cloth
Glass transition temp.(Tg) DMA*2 A °C 270 270
Thermal decomposition temp.(Td) TGA A °C 365 365
CTE x-axis α1 Internal method A ppm/°C 3-5 5-7
CTE y-axis 3-5 5-7
Flexural modulus*1 Warp JIS C 6481 25°C GPa 20 17
Fill 19 16

The sample thickness is 0.1 mm.
*1 0.8mm
*2 Measurement in tensile mode

Our Halogen-free materials are based on JPCA-ES-01-2003 standard and others.
Contain; Chlorine:≤0.09wt%(900ppm), Bromine:≤0.09wt%(900ppm),

The above data are typical values and not guaranteed values.

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