- Realize low warpage at several type of IC package by low stress property
Circuit Board Materials
- Part Number
Low CTE glass cloth
Laminate R-G525T
Prepreg R-G520T
Normal glass cloth
Laminate R-G525F
Prepreg R-G520F
- Application
IC substrate
New branding announcement
- Panasonic Electronic Materials Division launches a new product brand for the Semiconductor Device Materials business.
The LEXCM brand now comprises all of the Semiconductor Device Materials; IC packaging materials (which includes substrates, encapsulants and underfills) and electronic assembly materials.
Additionally, the IC substrate materials' brand is transitioning from MEGTRON GX to LEXCM GX.
Properties
Low Stress
CTE x, y-axis
3-5ppm/°C
3-5ppm/°C
Tg (DMA)
270°C
270°C
IC packages warpage
General properties
| Item | Test method | Condition | Unit | LEXCM GX R-G525T Low CTE glass cloth |
LEXCM GX R-G525F Normal glass cloth |
|
|---|---|---|---|---|---|---|
| Glass transition temp.(Tg) | DMA*2 | A | °C | 270 | 270 | |
| Thermal decomposition temp.(Td) | TGA | A | °C | 365 | 365 | |
| CTE x-axis | α1 | Internal method | A | ppm/°C | 3-5 | 5-7 |
| CTE y-axis | 3-5 | 5-7 | ||||
| Flexural modulus*1 | Warp | JIS C 6481 | 25°C | GPa | 20 | 17 |
| Fill | 19 | 16 | ||||
The sample thickness is 0.1 mm.
*1 0.8mm
*2 Measurement in tensile mode
Our Halogen-free materials are based on JPCA-ES-01-2003 standard and others.
Contain; Chlorine:≤0.09wt%(900ppm), Bromine:≤0.09wt%(900ppm),
Chlorine+Bromine:≤0.15wt%(1500ppm)
The above data are typical values and not guaranteed values.
