Mapping bonding feature ＜Reduction of die sorting process＞
Dies on a wafer, with specified ranks assigned to each, are bonded on a PCB in the specified rank order
Dies with specified ranks on a wafer are bonded to their respective specified rank locations on a PCB
The large-sized touch panel and the interactive software realize an easy and reliable operating environment for all users from beginners to experts.
|Productivity *1||0.73 s / IC for thermosonic bonding
(Including process time of 0.2 seconds. Under the fastest conditions)
|Placement accuracy *1||XY (3 at PFSC conditions) : ±7 µm|
|Substrate dimensions (mm)||L 50 x W 30 to L 120 x W 120|
|Die dimensions (mm)||L 0.25 x W 0.25 to L 6 x W 6|
|Number of die types||1 product type (manual wafer supply) / Up to 12 product types (AWC specifications)|
|Die supply||Wafer frame, Tray|
|Bonding load||VCM head for thermosonic process : 1 N to 50 N (Option : 2 N to 100 N)|
|Head heating||Up to 300°C for the VCM head|
|Substrate heating||Constant heating, Up to 300°C|
|Power source *2||3-phase AC 200 V ±10V, 50 / 60 Hz,
Up to 4 kVA (Up to 7.5 kVA for heating specification)
|Pneumatic source||0.5 MPa, 30 L / min (A.N.R.)
(Up to 150 L / min for full-featured machine including cooling air)
|Dimensions (mm)||Standard specification : W 1 410 x D 1 190 x H 1 480 (Including loader/unloader)
(Machine body : W 1 190 x D 1 190 x H 1 480)
|Mass||1 800 kg (Including loader / unloader)|
*1 : The described productivity and placement accuracy may differ depending on the conditions of use.
*2 : Three phase 208 / 220 / 380 / 400 / 415 / 480
For details, refer to the specification.