- Corresponding to the diverse applications such as adhesion, filling sealing, dam formation.
- Rapid curing at low temperatures and excellent adhesion. (Epoxy resin)
- Designed for curing with low-energy irradiation including LED-based UV light sources.(UV curing resin)
Semiconductor Encapsulation Materials/Adhesive
- Part Number
CV5000 series
CV7000 series
- Application
- Detailed use
・Mobile
・Automotive
・Automotive
Camera module, Image sensor, Panel displays, etc.
Properties
Bonding of various materials
Solvent resistance
Time-lagged curing
Use site and characteristics
Liquid adhesive with high adhesion, viscosity stability, workability and low-temperature rapid curability. Available for bonding of plastic lenses and housings in camera module and image sensor that requires positional accuracy and low temperature bonding.
A variety of curing types such as Thermal curing, UV curing, UV + Thermal curing, and Time-lagged curing are available for bonding and sealing of various devices according to the application and process.
Test results
Features of UV time-lagged curing(XV7831)
- Time-lagged UV curing type can control the open time and curing time according to the application.
- Applicable to the site where the UV light hardly reaches after assembly.
- Temporary curing and lead time reduction is possible by low temperature and short time curing.
- High aspect ratio of the application shape means that the strong adhesion makes it possible to apply the adhesive on a small surface.
General properties
| Item | Unit | CV5390 | XV7831 |
|---|---|---|---|
| Curing Type | - | Thermosetting | UV(Time-lagged) curing |
| Viscosity | Pa·s | 3 | 45 |
| Thixotropic index | - | 1.0 | 1.1 |
| Tg | °C | 80 | 35 |
| C.T.E | ppm/K | 70 | 75 |
| Pot life@25°C | days | 3 | 2 |
| Curing condition | - | 80°C/10-30 min | 365nm LED-UV: 500mJ/cm2 + Normal temp. leaving 4hrs or more* |
*Curing time can be shortened by heating +50°C 30min. +60°C 15min
The above data are typical values and not guaranteed values.
