FOG bonder supporting panel size of 1 to 17-inch |
Support wide range of FPC bonding from ones used for feature phone / smart phone to those for tablet or notebook PC |
Consistent paired line composed of normal (left to right) / reverse (right to left) flows helps promote efficiency in factory management |
A consistent production line from COG to FOG is achieved by connecting with our COG bonder (FPX005CG / FPX105CG) |
Model ID | FPX105FG | |||||
Model No. | NM-EFL1QC (Normal Flow : Left to Right) NM-EFL1QC-M (Reverse Flow : Right to Left) |
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Panel Size (mm) | L 30 x W 25 to L 390 x W 220 (equal to 1- to 17-inch) Glass thickness:0.3 to 1.1 Total panel thickness:0.6 to 2.5 |
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Cycle Time | 3.0 s / panel (1 FPC onto 4-inch panels)*1 10.5 s / panel (One long FPC / 10-inch panel)*2 |
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Final Bonding Accuracy*3 | XY : ±10 µm / 3σ after final bonding | |||||
ACF Size (mm) | Width 1.0 to 2.0 Reel diameter:Max.φ200 | |||||
FPC Size (mm) | Outer dimensions L 10 x W 10 x T 0.04 to L 210 x W 100 x T 2 Bonding length X 10 to 155 |
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FPC Tray Size (mm) | For use in stacking FPC trays L 210 x W 240 x T 6 to L 300 x W 400 x T 10 For use with tray holder L 210 x W 240 x T 6 to L 250 x W 330 x T 10 |
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Press Specification |
Process | ACF attachment | Pre-bonding | Final bonding | ||
Short head | Long head | Short head | Long head | |||
Temperature*5 | 40 to 120 ºC | 40 to 120 ºC | 40 to 320 ºC | |||
Pressure | 20 to 160 N | 20 to 250 N | 10 to 20 N | 50 to 300 N | 100 to 700 N | |
Power source | 3-phase AC 200 / 220 / 380 / 400 V, 50 / 60 Hz, 6.0 kVA | |||||
Pneumatic Source | 0.45 MPa, 400 L/min (A.N.R.) | |||||
Vacuum source | -0.08 Mpa x 2 lines, 240 L/min (Total suction flow rate) | |||||
Dimensions *6 (mm) | W 3 962 x D 1 830 x H 1 600*7 (FPC supply unit included) | |||||
Mass*6 | 3 100 kg |