Improved versatility
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Actualization of high accuracy bonding
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Actualization of high productivity
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Pursuit of high quality
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Model ID | FPX005CG | |||
Model No. | NM-EFL1MC (Normal Flow:Left to Right) / NM-EFL1MC-M (Reverse Flow:Right to Left) | |||
Panel Size (mm) | L 30 x W 25 to L 165 x W 100 (equal to 1- to 7-inch) Glass thickness:0.3 to 1.1 Total panel thickness:0.6 to 2.5 |
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Cycle Time | 3.0 s / panel*1 | |||
Final Bonding Accuracy*2 | For panels measuring 1 IC / 5-inch after final bonding XY: ±3 µm / 3σ For other conditions, XY: ±5 µm / 3σ |
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ACF Size (mm) | Width 1.0 to L 2.0 Reel diameter:Max.φ200 | |||
IC Size (mm) | L 7 x W 0.7 x T 0.3 to L 30 x W 1.5 x T 1.0 | |||
Press Specification |
Process | ACF attachment | Pre-bonding | Final bonding |
Temperature*3 | 40 to 120 ºC | 40 to 120 ºC | 40 to 320 ºC (Backup stage:40 to 100 ºC) |
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Pressure | 20 to 160 N | 10 to 50 N | 50 to 400 N | |
Power source | 3-phase AC 200 / 220 / 380 / 400 V, 50 / 60 Hz, 6.0 kVA | |||
Pneumatic Source | 0.45 MPa, 400 L/min (A.N.R.) | |||
Vacuum source | -0.08 Mpa x 2 lines, 240 L/min (Total suction flow rate) | |||
Dimensions *4 (mm) | W 3 312 x D 1 400 x H 1 600*5 (Including IC supply unit) | |||
Mass*4 | 2 700 kg |