MD-P200US2 : Flip Chip Bonder

MD-P200US2
Features

Productivity improved by 11% (compared with MD-P200US)
High rigidity design and improved IC quick pick up motion brings improved productivity by 11% (0.65 s / IC), while keeping high accuracy of ±7 um / 3σ, and high productivity.

Real time US monitoring function
Real time US monitoring function realizes stable quality by monitoring process parameters during production.

Variation of advanced software functions
Various advanced software functions (option) will fulfill various requirement, depending on purposes
*Please refer to specifications for more detail.

Specification
Model ID MD-P200US2
Model No. NM-EFF1D
Productivity *1 0.65 s / IC for thermosonic bonding
(Including process time of 0.2 seconds. Under the fastest conditions)
Placement accuracy *1 XY (3 at Panasonic conditions) : ±7 µm
Substrate dimensions (mm) L 50 × W 30 to L 120 × W 120
Die dimensions (mm) L 0.25 × W 0.25 to L 6 × W 6
Number of die types 1 product type (manual wafer supply) / Up to 12 product types (AWC specifications)
*Nozzle is one type
Die supply Wafer frame (Max. 8 inch) , Tray
Bonding load VCM head for thermosonic process : 1 N to 50 N (Option : 2 N to 100 N)
Head heating Up to 300℃ for the VCM head
Substrate heating Constant heating, Up to 300℃
Power source *2 3-phase AC 200 V ±10V, 50 / 60 Hz,
Up to 1.7 kVA (Up to 7.5 kVA for heating specification)
Pneumatic source 0.4 to 0.5 Mpa (Max. 0.8 Mpa), 30 L / min (A.N.R.)
(Up to 150 L / min for full-featured machine including cooling air)
Dimensions (mm) W 1 340 × D 1 140 × H 1 400 (Including loader/unloader)
Mass 1 750 kg (Including loader / unloader)

*1 : The described productivity and placement accuracy may differ depending on the conditions of use.
*2 : Three phase 208 / 220 / 380 / 400 / 415 / 480
For details, refer to the specification.