Mapping bonding feature ＜Reduction of die sorting process＞
Dies on a wafer, with specified ranks assigned to each, are bonded on a PCB in the specified rank order
Dies with specified ranks on a wafer are bonded to their respective specified rank locations on a PCB
Friendly Operation
The large-sized touch panel and the interactive software realize an easy and reliable operating environment for all users from beginners to experts.
| Model ID | MD-P200US |
| Model No. | NM-EFF1B |
| Productivity *1 | 0.73 s / IC for thermosonic bonding (Including process time of 0.2 seconds. Under the fastest conditions) |
| Placement accuracy *1 | XY (3 at PFSC conditions) : ±7 µm |
| Substrate dimensions (mm) | L 50 x W 30 to L 120 x W 120 |
| Die dimensions (mm) | L 0.25 x W 0.25 to L 6 x W 6 |
| Number of die types | 1 product type (manual wafer supply) / Up to 12 product types (AWC specifications) |
| Die supply | Wafer frame, Tray |
| Bonding load | VCM head for thermosonic process : 1 N to 50 N (Option : 2 N to 100 N) |
| Head heating | Up to 300°C for the VCM head |
| Substrate heating | Constant heating, Up to 300°C |
| Power source *2 | 3-phase AC 200 V ±10V, 50 / 60 Hz, Up to 4 kVA (Up to 7.5 kVA for heating specification) |
| Pneumatic source | 0.5 MPa, 30 L / min (A.N.R.) (Up to 150 L / min for full-featured machine including cooling air) |
| Dimensions (mm) | Standard specification : W 1 410 x D 1 190 x H 1 480 (Including loader/unloader) (Machine body : W 1 190 x D 1 190 x H 1 480) |
| Mass | 1 800 kg (Including loader / unloader) |
*1 : The described productivity and placement accuracy may differ depending on the conditions of use.
*2 : Three phase 208 / 220 / 380 / 400 / 415 / 480
For details, refer to the specification.
