MD-P200US : Flip Chip Bonder

MD-P200US
Features

Mapping bonding feature <Reduction of die sorting process>
Dies on a wafer, with specified ranks assigned to each, are bonded on a PCB in the specified rank order
Dies with specified ranks on a wafer are bonded to their respective specified rank locations on a PCB

Friendly Operation
The large-sized touch panel and the interactive software realize an easy and reliable operating environment for all users from beginners to experts.

Specification
Model ID MD-P200US
Model No. NM-EFF1B
Productivity *1 0.73 s / IC for thermosonic bonding
(Including process time of 0.2 seconds. Under the fastest conditions)
Placement accuracy *1 XY (3 at PFSC conditions) : ±7 µm
Substrate dimensions (mm) L 50 x W 30 to L 120 x W 120
Die dimensions (mm) L 0.25 x W 0.25 to L 6 x W 6
Number of die types 1 product type (manual wafer supply) / Up to 12 product types (AWC specifications)
Die supply Wafer frame, Tray
Bonding load VCM head for thermosonic process : 1 N to 50 N (Option : 2 N to 100 N)
Head heating Up to 300°C for the VCM head
Substrate heating Constant heating, Up to 300°C
Power source *2 3-phase AC 200 V ±10V, 50 / 60 Hz,
Up to 4 kVA (Up to 7.5 kVA for heating specification)
Pneumatic source 0.5 MPa, 30 L / min (A.N.R.)
(Up to 150 L / min for full-featured machine including cooling air)
Dimensions (mm) Standard specification : W 1 410 x D 1 190 x H 1 480 (Including loader/unloader)
(Machine body : W 1 190 x D 1 190 x H 1 480)
Mass 1 800 kg (Including loader / unloader)

*1 : The described productivity and placement accuracy may differ depending on the conditions of use.
*2 : Three phase 208 / 220 / 380 / 400 / 415 / 480
For details, refer to the specification.