Metallized 2-Layers of Copper + Nickel + Conductive Adhesion Agent

EYJB（D）

  • Strengthened grand performance by attaching conductive adhesion agent with the thickness of 35µm on the metallized side of EYJB(B) type.
    Both roll(maximum width: 120mm) and Piercing processing are available.

Feature

  • -Pressure adhered at normal temperature.
  • -Excellent conductivity and long-term secure adhesive strength.
  • -High accurate Piercing processing.

Structure

Shield Characteristics

Example of Use

  • -Shield Film for Mobile Devices
    (LCD Chassis, Isolator, etc.)
  • -Shield Film for Flat Cable
  • -Conductive Tape

Example of product specification

Example of order product number

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