High fluidity LCP resin Molding Compound for Mobile Products | MBL540V, MBL240V

High fluidity LCP resin Molding Compound for Mobile Products

  • MBL540V MBL240V

For mobile products

Connector, Electronic components

Achieving high fluidity and heat resistance at narrow gate

Achieving high fluidity and heat resistance at narrow gate

Measurement of (maximum) tensile strength of portion having weld line

Measurement of (maximum) tensile strength of portion having weld line

Warpage reduction comparison

Warpage reduction comparison

General properties

Evaluation using test piece having connector shape For narrow-pitch connector Wide use connector
MBL540V MBL240V Our prototype
Weld strength High strength Conventional LCP
Bending strength Molding compound A N 22 23 18
Amount of bending deflection Molding compound A mm 0.80 0.75 0.43
Flexural modulus Molding compound A GPa 15 18 20
Tensile strength of the welding part Molding compound A N 36 34 17
Warpage Molding compound B mm 0.068 0.071 0.130
Warpage
(After 270°C reflow×3times)
Molding compound B mm 0.075 0.082 0.143
Fluidity(Injection flow) Molding compound B mm 52 55 45

The above data is actual values and not guaranteed values.

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