Plasma Cleaner [Solution]

Plasma Cleaning Process

Wafer application

PSX307A

PSX307A

  • Wafer cleaning/modificationfor flip chip die attach/solder ball attach/stack die attach
  • Solder ball cleaning for WLCSP
  • De-scum process for plating process
 
Packaging application

PSX307

PSX307A

  • Electrode cleaning for wire bonding& flip-chip bonding
  • Surface modification for mold and underfill
 

Plasma Cleaning Process Application

Wire-BondingBondability

Memory

UnderfillAdhesive

Processor

LED PackingBondability

LED

Flip-Chip BondingBondability

SAW
RF module

 

Feature of Plasma Cleaner PSX Series

Plasma monitor allows to avoid abnormal discharge on thin substrate

Panasonic Patent

  • Prevent defect substrate passing to next process.
  • Record the log data of monitor for each substrates(option).

Process analysis & solution proposal for customer

  • Provide issue-solving consulting for customer.
  • Implement demonstration with analytical equipment and support process improvement.