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| Mounting position feed-forward function Components can be placed in the correct position based on the solder printing position. |
| Placement skip data feed-forward/Block recognition data feed-forward Modular placement machine's recognition time can be reduced through feeding forward the discrepancy data. Modular placement machine's block recognition time can be reduced through feeding forward the block data. Misplacement of components using a modular placement machine can be prevented through feeding forward solder/land* printing defect block data. *When inspecting lands on which package components are placed using flux epoxy. |
| Printing position data feed-back Solder printing position misalignment amount is measured with the inspection machine. The positioning correction amount can be fed back to a screen printer. Solder printing area is measured with the inspection machine. The stencil cleaning direction can be fed back through compared to the reference value. |
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| Model ID | APC-80 |
| Model No. | NM-EJS7A |
| Basic functions | Feed-back of data to printer Print position adjusting data Stencil cleaning data Feed-forward of data to Placement machine Component placement position adjusting data Block recognition data Block placement skip data |
| PCB dimensions (mm) | L 50 x W 50 to L 460 x W 360 *1 |
| PCB materials | Glass epoxy, Phenol, Flexible, Ceramic *2 |
| Component types | Square chips (from 0402 or 01005” to 3216 or 1206”), SOP, QFP, connector, BGA, CSP (from 0.5mm to 0.3mm pitch) *3 |
| Applicable equipment | VC45C (indispensable), CM602, CM212, CM101, SP60P |
| Number of components | Max. 10 000 components |
| System license | One license per line is required. |
*1:PCB dimensions vary according to maximum board dimensions for line configured equipment.
*2:For ceramic PCB, recognition of printed solder is required.
*3:Please refer to the "Specification" handbook for details of applicable components.
*Please refer to the "Specification" booklet for details.
*APC-80 is a system software for printer (SP60P), AOI (VC45C) and the modular placement machine (CM602,CM212,CM101).
*2:For ceramic PCB, recognition of printed solder is required.
*3:Please refer to the "Specification" handbook for details of applicable components.
*Please refer to the "Specification" booklet for details.
*APC-80 is a system software for printer (SP60P), AOI (VC45C) and the modular placement machine (CM602,CM212,CM101).