|Mounting position feed-forward function
Components can be placed in the correct position based on the solder printing position.
|Placement skip data feed-forward/Block recognition data feed-forward
Modular placement machine's recognition time can be reduced through feeding forward the discrepancy data.
Modular placement machine's block recognition time can be reduced through feeding forward the block data.
Misplacement of components using a modular placement machine can be prevented through feeding forward solder/land* printing defect block data.
*When inspecting lands on which package components are placed using flux epoxy.
|Printing position data feed-back
Solder printing position misalignment amount is measured with the inspection machine. The positioning correction amount can be fed back to a screen printer.
Solder printing area is measured with the inspection machine. The stencil cleaning direction can be fed back through compared to the reference value.
|Basic functions||Feed-back of data to printer
Print position adjusting data
Stencil cleaning data
Feed-forward of data to Placement machine
Component placement position adjusting data
Block recognition data
Block placement skip data
|PCB dimensions (mm)||L 50 x W 50 to L 460 x W 360 *1|
|PCB materials||Glass epoxy, Phenol, Flexible, Ceramic *2|
|Component types||Square chips (from 0402 or 01005” to 3216 or 1206”), SOP, QFP,
connector, BGA, CSP (from 0.5mm to 0.3mm pitch) *3
|Applicable equipment||VC45C (indispensable), CM602, CM212, CM101, SP60P|
|Number of components||Max. 10 000 components|
|System license||One license per line is required.|