ICTインフラ機器用 多層基板材料「MEGTRON」シリーズ : 品番

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データシート
シリーズ/タイプ ガラス転移温度(Tg):DSC
(°C)
ガラス転移温度(Tg):TMA
(°C)
ガラス転移温度(Tg):DMA
(°C)
熱分解温度(Td):TGA
(°C)
T288(銅無):IPC-TM-650 2.4.24.1
(min)
T288(銅付):IPC-TM-650 2.4.24.1
(min)
熱膨張係数: α1 タテ方向,IPC-TM-650 2.4.24
(ppm/°C)
熱膨張係数:α1 ヨコ方向,IPC-TM-650 2.4.24
(ppm/°C)
熱膨張係数:α1 厚さ方向,IPC-TM-650 2.4.24
(ppm/°C)
熱膨張係数:α2 厚さ方向,IPC-TM-650 2.4.24
(ppm/°C)
熱伝導率:レーザーフラッシュ法,25˚C
(W/m·K)
体積抵抗率:IPC-TM-650 2.5.17.1,C-96/35/90
(MΩ·cm)
表面抵抗:IPC-TM-650 2.5.17.1,C-96/35/90
(MΩ)
比誘電率(Dk))@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 比誘電率(Dk)@10GHz:IPC-TM-650 2.5.5.5,C-24/23/50 比誘電率(Dk)@12GHz:平衡型円板
共振器法,C-24/23/50
比誘電率(Dk)@14GHz:平衡型円板
共振器法,C-24/23/50
誘電正接(Df)@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 誘電正接(Df)@10GHz:IPC-TM-650 2.5.5.5,C-24/23/50 誘電正接(Df)@12GHz:平衡型円板
共振器法,C-24/23/50
誘電正接(Df)@14GHz:平衡型円板
共振器法,C-24/23/50
吸水率:IPC-TM-650 2.6.2.1,D-24/23
(%)
曲げ弾性率 タテ方向:JIS C 6481
(GPa)
曲げ弾性率 ヨコ方向:JIS C 6481
(GPa)
銅箔引き剥がし強さ 1oz:IPC-TM-650 2.4.8
(kN/m (lb/inch))
銅箔引き剥がし強さ 1oz(H-VLP3):IPC-TM-650 2.4.8
(kN/m)
耐燃性:UL法,C-48/23/50 サンプル厚さ 上記データは当社測定による代表値であり、保証値ではありません。 *1 試験方法:TMA
R-1577/R-1570
MEGTRON2, MEGTRON2E
Halogen-free Low transmission loss Highly heat resistant Multi-layer circuit board materials
170 165 190 380 >120 25 14-16 14-16 34 200 0.5 1 x 10⁹ 1 x 10⁸ 4.1 - 4 - 0.01 0.013 - - 0.14 25 23 1.3(7.4) - 94V-0 0.8mm - -
R-1577E/R-1570E
MEGTRON2, MEGTRON2E
Halogen-free Low transmission loss Highly heat resistant Multi-layer circuit board materials
173 170 190 385 >120 25 14-16 14-16 35 210 0.5 - - 4.2 - 4.1 - 0.01 0.013 - - - 25 23 1.3(7.4) - 94V-0 0.8mm - -
R-1755V
HIPER V
Highly heat resistant Low CTE Multi-layer circuit board materials <High-Tg type>
173 165 190 350 >120 20 11-13 13-15 44 255 0.53 1 x 10⁹ 1 x 10⁸ 4.4 - 4.3 - 0.016 0.02 - - 0.12 24 22 1.5(8.6) - 94V-0 0.8mm - -
R-5375(E)/R-5370(E)
Halogen-free MEGTRON6 series
Halogen-free Ultra-low transmission loss Multi-layer circuit board materials,
- 210 250 435 >120 >120 14-16 14-16 39 200 0.37 1 x 10⁹ 1 x 10⁸ 3.7 - 3.7 - 0.002 - 0.002 - 0.22 19 18 0.6(3.4)
(Cu:H-VLP2)
- 94V-0
equivalent
0.75mm - -
R-5375(N)/R-5370(N)
Halogen-free MEGTRON6 series
Halogen-free Ultra-low transmission loss Multi-layer circuit board materials,
- 210 250 435 >120 >120 14-16 14-16 39 200 0.37 1 x 10⁹ 1 x 10⁸ 3.4 - 3.4 - 0.001 - 0.001 - 0.23 20 19 0.6(3.4)
(Cu:H-VLP2)
- 94V-0
equivalent
0.75mm - -
R-5725/R-5620
MEGTRON4S, MEGTRON4
Low transmission loss Highly heat resistant Multi-layer circuit board materials
176 170 210 360 >120 30 12-14 13-15 35 265 0.6 1 x 10⁹ 1 x 10⁸ 3.8 - 3.8 - 0.005 0.007 - - 0.14 25 23 1.1(6.3)
(Cu:RT)
- 94V-0 0.8mm - -
R-5725S/5620S
MEGTRON4S, MEGTRON4
Low transmission loss Highly heat resistant Multi-layer circuit board materials
200 190 215 360 >120 50 12-14 13-15 32 250 0.6 1 x 10⁹ 1 x 10⁸ 3.8 - 3.8 - 0.005 0.007 - - 0.14 25 23 1.3(7.4)
(Cu:RT)
- 94V-0 0.8mm - -
R-5735/R-5630
MEGTRON M
Low transmission loss Highly heat resistant Multi-layer circuit board materials
- - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
R-5775(G)/R-5670(G)
MEGTRON6 series
Ultra-low transmission loss Highly heat resistant Multi-layer circuit board materials
185 - 210 410 >120 >120 14-16 14-16 45 260 0.42 1 x 10⁹ 1 x 10⁸ 3.7 - 3.6 - 0.002 - 0.004 - 0.14 20 19 0.8(4.6)
(Cu:H-VLP)
- 94V-0 0.75mm - -
R-5775(K)/R-5670(K)
MEGTRON6 series
Ultra-low transmission loss Highly heat resistant Multi-layer circuit board materials
185 - 210 410 >120 >120 14-16 14-16 45 260 0.42 1 x 10⁹ 1 x 10⁸ 3.7 - 3.6 - 0.002 - 0.004 - 0.14 20 19 0.8(4.6)
(Cu:H-VLP)
- 94V-0 0.75mm - -
R-5775(N)/R-5670(N)
MEGTRON6 series
Ultra-low transmission loss Highly heat resistant Multi-layer circuit board materials
185 - 210 410 >120 >120 14-16 14-16 45 260 0.42 1 x 10⁹ 1 x 10⁸ 3.4 - 3.4 - 0.002 - 0.004 - 0.14 19 18 0.8(4.6)
(Cu:H-VLP)
- 94V-0 0.75mm - -
R-5775(R)
MEGTRON6 series
Ultra-low transmission loss Highly heat resistant Multi-layer circuit board materials
- - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
R-5775(S)
MEGTRON6 series
Ultra-low transmission loss Highly heat resistant Multi-layer circuit board materials
- - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
R-5785(GE)/R-5680(GE)
MEGTRON7 series
Ultra-low transmission loss Highly heat resistant Multi-layer circuit board materials
200 - 210 400 >120 >120 14-16 14-16 42 280 0.4 1 x 10⁹ 1 x 10⁸ 3.6 - 3.6 - 0.002 - 0.003 - 0.06 20 19 0.8(4.6)
(Cu:H-VLP2)
- 94V-0 0.75mm - -
R-5785(GN)/R-5680(GN)
MEGTRON7 series
Ultra-low transmission loss Highly heat resistant Multi-layer circuit board materials
200 190 210 400 >120 >120 14-16 14-16 42 280 0.4 1 x 10⁹ 1 x 10⁸ 3.4 - 3.4 - 0.001 - 0.002 - 0.06 19 18 0.8(4.6)
(Cu:H-VLP2)
- 94V-0 0.75mm - -
R-5785(GN)/R-5681(GN)
MEGTRON7 series
Ultra-low transmission loss Highly heat resistant Multi-layer circuit board materials
200 190 210 400 >120 >120 - - - - - - - - - - - - - - - - - - - - - - - -
R-5785(N)/R-5680(N)
MEGTRON7 series
Ultra-low transmission loss Highly heat resistant Multi-layer circuit board materials
200 - 210 400 >120 >120 14-16 14-16 42 280 0.4 1 x 10⁹ 1 x 10⁸ 3.4 - 3.4 - 0.001 - 0.002 - 0.06 19 18 0.8(4.6)
(Cu:H-VLP)
- 94V-0 0.75mm - -
R-5785(R)
MEGTRON7 series
Ultra-low transmission loss Highly heat resistant Multi-layer circuit board materials
- - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
R-5795(N)
MEGTRON8 series
Ultra low transmission loss, highly heat-resistant multi layer circuit board materials
- - 220 370 - >60 17-20 17-20 50 270 - - - - - - 3.13 - - - 0.0016 0.06 - - - 0.7 94V-0 0.75mm - -
R-5795(U)
MEGTRON8 series
Ultra low transmission loss, highly heat-resistant multi layer circuit board materials
- - 220 370 - >60 17-20 17-20 50 270 - - - - - - 3.08 - - - 0.0012 0.06 - - - 0.7 94V-0 0.75mm - -