用途別商品一覧 Products of application
High speed transmission
ICT インフラ機器用途
For ICT infrastructure equipment
For ICT infrastructure equipment
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MEGTRON6 の1/2 のDf 値を実現。業界最高の低伝送損失で、次世代ICT 機器の高速伝送に貢献。
Realize 1/2, Df (dissipation factor) MEGTRON6. Contributing to the high-speed transmission of next generation ICT infrastructure equipment by low transmission loss of the industry's highest.
MEGTRON7
Laminate: R-5785 / Prepreg: R-5680 (PDF:951KB)
特設サイトはコチラ
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サーバなどのネットワーク機器向け、高速化、超低ロス基板材料
High speed and ultra-low loss multi-layer circuit board materials for networking equipment, such as servers.MEGTRON6
Laminate: R-5775/R-5775(N) / Prepreg: R-5670/R-5670(N) (PDF:545KB) -
鉛フリーはんだに対応し、高耐熱性と高信頼性に優れた低ロス基板材料
Low loss multi-layer circuit board materials with high heat resistance and high reliability and compatible with lead-free soldering.MEGTRON4
Laminate: R-5725 / Prepreg: R-5620 (PDF:533KB) -
ハロゲン・アンチモンフリー、鉛フリーはんだ対応と環境に配慮したミドルロス基板材料
Environmentally friendly middle loss circuit board material that is halogen-free and antimony-free and compatible with lead-free soldering.Halogen-free MEGTRON2
Laminate R-1577 / Prepreg R-1570 (PDF:569KB)
Thinner
モバイル機器用途
For mobile products
For mobile products
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低誘電率化により電子回路基板の極薄化をサポート
Making of ultrathin circuit boards is supported by low Dk.Halogen-free
Laminate: R-A555 / Prepreg: R-A550 (PDF:485KB) -
高耐熱性、耐CAF 性に優れたハロゲンフリー多層基板材料
Halogen-free multi-layer circuit board materials with high heat resistance and CAF resistance.Halogen-free
Laminate: R-1533 / Prepreg: 1530 (PDF:804KB) -
耐熱性、信頼性に優れ、当社汎用FR-4（R-1766）と同等のレベルを持つ環境対応基板材料
Environmentally friendly multi-layer circuit board materials with high heat resistance and reliability, with a same level as our conventional FR-4 (R-1766).Halogen-free
Laminate: R-1566(W/WN) / Prepreg: R-1551(W/WN) (PDF:533KB) -
優れた寸法安定性とスプリングバック性
Excellent dimensional stability and Spring back performance.FELIOS
R-F775 スタンダードタイプ , R-F786W 高耐熱タイプ (PDF:592KB) -
高周波特性・耐湿性に優れ、環境変化に対し、優れた低伝送損失を実現
Achieve the stability under moisture absorption and the high frequency performance, low transmission loss under various moisture absorption environment.FELIOS LCP
R-F705T 両面板 (PDF:610KB) -
多層基板の薄型化（4層 0.2mm）に貢献し、加工プロセスの低減が可能
Available to multi-layer circuit board thinner (4 layer 0.2mm) and decrease a manufacture process.FELIOS FRCC
R-FR10 薄型多層向け材料 (PDF:580KB)
半導体パッケージ用途
For IC substrates
For IC substrates
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低熱膨張数0.5ppm/℃（面方向）の実現により薄型半導体パッケージ基板の反りを低減
Decrease the warpage of thin IC substrate board realized by low CTE 0.5ppm/℃ (in-plane direction).MEGTRON GX
Laminate (Black) : R-1515U / Prepreg (Natural color) : R-1410U (PDF:548KB) -
低熱膨張係数（3.5ppm/℃）・優れた耐熱性（Tg 275℃）で薄型半導体パッケージ基板の反りを低減
Decrease the warpage of thin IC substrate board realized by low CTE 3.5ppm/℃ and good high heat resistance (275℃).MEGTRON GX
Laminate(Black) : R-1515D / Prepreg (Natural color) : R-1410D (PDF:476KB) -
更なる基板の反り低減に貢献する低熱膨張、高信頼性を有したハロゲンフリー材料
Halogen-free materials with low CTE for further decrease the warpage of IC substrate boards and excellent high reliability.MEGTRON GX
Laminate (Black) : R-1515E / Prepreg (Natural color) : R-1410E (PDF:926KB)
High thermal dissipation
LED照明・車載機器用途
For LED lightings / backlights and Automotive components
For LED lightings / backlights and Automotive components
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多層材で高熱伝導1.5W/m・Kを実現
Realized high thermal conductivity 1.5 W/m・K at Multi-layer materials.ECOOL-M
Laminate: R-15T1 / Prepreg: R-14T1 (PDF:334KB) -
高熱伝導性を実現！放熱性とトラッキング性が要求される電源用途にも適した高放熱基板材料
Realization of high thermal conductivity! High heat dissipation circuit board materials also suitable for power supply applications requiring high levels of heat dissipation and tracking resistance.ECOOL
R-1787 1.1W/m・Kタイプ , R-1586(H) 1.5W/m・Kタイプ (PDF:294KB) -
高熱放散性・高耐電圧を実現し、LEDなどの発熱デバイスの放熱に貢献
Realize high levels of heat dissipation and dielectric strength,contributing to heat dissipation in heat generating devices such as LEDs.ECOOL-F
R-F775 (PDF:295KB) -
パワーチップの発熱を効率よくクールダウンする高流動・高熱伝導を特長とした絶縁樹脂シート
Realize high heat dissipation in heat generating devices.
Insulated resin sheet with high fluidity and high thermal conductivity.ECOOL-Sheet
CV2079 (PDF:677KB)
High reliability
車載機器用途
For Automotive components
For Automotive components
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信頼性と基板加工性を両立し、高温環境に対応可能な多層基板材料
Multi-layer circuit board materials balance reliability and laminate processability and available to uses in high temperature environment.
High Tg / 低熱膨張タイプ(xyz方向)HIPER D
Laminate R-1755D / Prepreg R-1650D (PDF:578KB) -
エンジンルーム内など高温環境に対応するMiddle-Tg 多層基板材料
Middle-Tg multi-layer circuit board materials available to uses in high temperature environment, such as an engine room.
Middle-Tg / 低熱膨張タイプHIPER M
Laminate R-1755M / Prepreg R-1650M (PDF:574KB) -
グローバル供給が可能なさまざまな用途に適用できる高耐熱に優れた基板材料
Multi-layer circuit board materials with high heat resistance that available to various applications and global supply.
低熱膨張タイプHIPER E
Laminate R-1755E / Prepreg R-1650E (PDF:624KB)
- カタログダウンロード Download Catalog (PDF:7.05MB)
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高熱伝導ゴムシート（TIM）チラシダウンロード
Download flyer of High thermal conductive rubber sheet (TIM) (PDF:1.51MB)
※3D実装デバイス “MIPTEC” に関する情報はコチラ