Strengths of Panasonic display-related systems

High-quality and high-reliability mounting process solutions with the industry’s number-one track record

The FPD manufacturing process has a step of mounting a driver IC and FPC on a panel. This step requires a particularly high level of precision. Panasonic offers our time-tested high-quality and high-reliability mounting solutions and mass production systems that dependably manufacture conforming products.

Image: High-quality and high-reliability mounting process

Products

List by process and application

Display-related systems lineup by process and application


List by process and application

Features of Panasonic display-related systems

IC/TCP bonders

IC/TCP bonding is available by changing the component supply units.
Our original fixed-point mounting (temporary bonding) ensures high-precision mounting.

COG/FOP Dual-purpose Bonder FPX007CG/FP

FPC bonders

Equipped with a universal tool for temporary bonding.
Highly adaptable to various shapes and sizes of FPCs

FOG/FOF Dual-purpose Bonder FPX007FG/FF

Impression inspection machines

High-speed, high-accuracy inspection of ACF bonding conditions of mounted components.
Capable of inspecting all mounted components and pins using a line scan camera

Impression Inspection Machine FPX101AI

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