R-G535E : 半导体封装基板材料「LEXCM GX」系列

产品名

半导体封装基板材料「LEXCM GX」系列

系列/类型

High modulus Low CTE IC substrate materials

型号

R-G535E

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特性值

项目	内容
Glass transition temp.(Tg) :DSC	-
Glass transition temp.(Tg) :TMA (°C)	210
Glass transition temp.(Tg) :TMA Measurement in tensile mode (°C)	-
Glass transition temp.(Tg) :DMA (°C)	260
Glass transition temp.(Tg) :DMA Measurement in tensile mode (°C)	-
Thermal decomposition temp.(Td):TGA (°C)	365
Time to delam(T288)Without Cu:IPC-TM-650 2.4.24.1 (min)	-
Time to delam(T288)With Cu:IPC-TM-650 2.4.24.1 (min)	-
CTE:α1,X-axis,IPC-TM-650 2.4.24 (ppm/°C)	7-8
CTE:α1,Y-axis,IPC-TM-650 2.4.24 (ppm/°C)	7-8
CTE:α1,Z-axis,IPC-TM-650 2.4.24 (ppm/°C)	20
CTE:α2,Z-axis,IPC-TM-650 2.4.24 (ppm/°C)	100
Thermal conductivity:Laser flash,25˚C (W/m·K)	0.55
Volume resistivity:IPC-TM-650 2.5.17.1,C-96/35/90 (MΩ·cm)	1 x 10⁸
Surface resistivity:IPC-TM-650 2.5.17.1,C-96/35/90 (MΩ)	1 x 10⁸
Dielectric constant(Dk)@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50	4.6
Dielectric constant(Dk)@10GHz:IPC-TM-650 2.5.5.5,C-24/23/50	-
Dielectric constant(Dk)@12GHz:Balanced-type circular disk resonator,C-24/23/50	-
Dissipation factor(Df )@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50	0.015
Dissipation factor(Df )@10GHz:IPC-TM-650 2.5.5.5,C-24/23/50	-
Dissipation factor(Df )@12GHz:Balanced-type circular disk resonator,C-24/23/50	-
Water absorption:IPC-TM-650 2.6.2.1,D-24/23 (%)	0.15-0.20
Flexural modulus,Warp/MD:JIS C 6481 (GPa)	29
Flexural modulus,Fill/TD:JIS C 6481 (GPa)	28
Peel strength,1oz:IPC-TM-650 2.4.8 (kN/m (lb/inch))	0.6(3.4) (12μm)
Flammability:UL,C-48/23/50	-
The sample thickness	The sample thickness is depending on the test method.
The above data are typical values and not guaranteed values.	-
*1 Test method: TMA	-