R-1515E/R-1410E : 半导体封装基板材料「LEXCM GX」系列

产品名
半导体封装基板材料「LEXCM GX」系列

系列/类型
High elasticity Low CTE Ultra-thin IC substrate materials

型号
R-1515E/R-1410E

放大
一张照片：R-1515E/R-1410E
项目 内容
Glass transition temp.(Tg) :DSC -
Glass transition temp.(Tg) :TMA (°C) -
Glass transition temp.(Tg) :TMA
Measurement in tensile mode (°C)		 240
Glass transition temp.(Tg) :DMA (°C) -
Glass transition temp.(Tg) :DMA
Measurement in tensile mode (°C)		 270
Thermal decomposition temp.(Td):TGA (°C) 390
Time to delam(T288)Without Cu:IPC-TM-650 2.4.24.1 (min) >120
Time to delam(T288)With Cu:IPC-TM-650 2.4.24.1 (min) >120
CTE:α1,X-axis,IPC-TM-650 2.4.24 (ppm/°C) 8-10 *1
CTE:α1,Y-axis,IPC-TM-650 2.4.24 (ppm/°C) 8-10 *1
CTE:α1,Z-axis,IPC-TM-650 2.4.24 (ppm/°C) 22
CTE:α2,Z-axis,IPC-TM-650 2.4.24 (ppm/°C) 95
Thermal conductivity:Laser flash,25˚C (W/m·K) 0.7
Volume resistivity:IPC-TM-650 2.5.17.1,C-96/35/90 (MΩ·cm) 1 x 10⁹
Surface resistivity:IPC-TM-650 2.5.17.1,C-96/35/90 (MΩ) 1 x 10⁸
Dielectric constant(Dk)@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 4.7
Dielectric constant(Dk)@10GHz:IPC-TM-650 2.5.5.5,C-24/23/50 -
Dielectric constant(Dk)@12GHz:Balanced-type circular disk resonator,C-24/23/50 -
Dissipation factor(Df )@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 0.011
Dissipation factor(Df )@10GHz:IPC-TM-650 2.5.5.5,C-24/23/50 -
Dissipation factor(Df )@12GHz:Balanced-type circular disk resonator,C-24/23/50 -
Water absorption:IPC-TM-650 2.6.2.1,D-24/23 (%) 0.3
Flexural modulus,Warp/MD:JIS C 6481 (GPa) 35
Flexural modulus,Fill/TD:JIS C 6481 (GPa) 33
Peel strength,1oz:IPC-TM-650 2.4.8 (kN/m (lb/inch)) 0.9(5.1)
(12μm)
Flammability:UL,C-48/23/50 94V-0
The sample thickness The sample thickness is depending on the test method.
The above data are typical values and not guaranteed values. -
*1 Test method: TMA -