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Passive & Electromechanical-ALIVH

Terms and Conditions Terms and Conditions
Series/Type Catalog Parts No Outline Features
- - - - -
ALIVH-G
ALIVH-G
PDF(44KB) EKWxxxxxxxxx
Any layer IVH structure with glass-epoxy material.
Higher adhesion strength between land and base with glass cloth.
ALIVH-C
ALIVH-C
PDF(50KB) EKWxxxxxxxxx
Collaboration of ALIVH-G high density wiring capacity and Build-up PWB versatility
Providing finer pattern utilizing high density wiring ability of ALIVH-G
ALIVH-B
ALIVH-B
PDF(71KB) EKWxxxxxxxxx
Any layer IVH structure PWB for bare chip mounting
High density pattern & small via at any layer, Via on via/Pad on via
NEW
ALIVH-3D

ALIVH-3D
PDF(59KB) EKYxxxxxxxxx
Any layer IVH structure Electronic Circuit Board
which have Cavity structure with Glass reinforced epoxy material
Achieve thinner module and package by mounting electronic devices in cavity