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Passive & Electromechanical-ALIVH

Terms and Conditions Terms and Conditions
Series/Type Catalog Parts No Outline Features
- - - - -
ALIVH-G
ALIVH-G 		PDF(44KB) EKWxxxxxxxxx
 Any layer IVH structure with glass-epoxy material.
 Higher adhesion strength between land and base with glass cloth.
ALIVH-C
ALIVH-C 		PDF(50KB) EKWxxxxxxxxx
 Collaboration of ALIVH-G high density wiring capacity and Build-up PWB versatility
 Providing finer pattern utilizing high density wiring ability of ALIVH-G
ALIVH-B
ALIVH-B 		PDF(71KB) EKWxxxxxxxxx
 Any layer IVH structure PWB for bare chip mounting
 High density pattern & small via at any layer, Via on via/Pad on via
NEW
ALIVH-3D
ALIVH-3D 		PDF(59KB) EKYxxxxxxxxx
 Any layer IVH structure Electronic Circuit Board
which have Cavity structure with Glass reinforced epoxy material
 Achieve thinner module and package by mounting electronic devices in cavity