| Series/Type |
Catalog |
Style |
Parts No |
Inductance range |
DC current |
Features |
Recommended Applications |
RoHS |
| - |
- |
- |
- |
- |
max.(mA) |
- |
- |
- |
 Signal Processing Use (Low distortion type), DA and FA***D |
 |
 |
ELJDA101xF
ELJDA680xF
ELJDA820xF
ELJFA101xFD
ELJFA680xFD
ELJFA820xFD
|
68microH to 100microH
|
1.(Type DA) 70,80,85
2.(Type FA***D) 70,75,85
|
1.General use wire wound and resin molded chip inductor.
2.Low distortion type suitable for Signal processing.
3.2 line-up of Super low distortion series and low distortion type.
4.Good mounting characteristic.
|
1.All kinds of Broadband Modem, Router and STB etc.
2.Corresponds to Broadcom BCM63** series chipset
|
for RoHS
|
| High Freq.Use(Non magnetic) RF/RE/ND/NC/NA |
|
 |
ELJNAxxxxF
ELJNCxxxxF
ELJNDxxxxF
ELJRExxxxFA
ELJRFxxxxFB
|
1.(Type:RF) 1.0nH to 100nH
2.(Type:RE) 1.0nH to 220nH
3.(Type:ND) 10nH to 1000nH
4.(Type:NC) 10nH to 820nH
5.(Type:NA) 47nH to 8200nH
|
1.(Type:RF) 400 to 90
2.(Type:RE) 500 to 70
3.(Type:ND) 540 to 120
4.(Type:NC) 280 to 100
5.(Type:NA) 450 to 60
|
1.High frequency capability due to its non magnetic core.
2.Capable of being Re-flow or flow soldered.
3.Wide line-up from 1005 to 3225 case sizes.
4.Good for mounting.
|
1.RF circuitry for cellular phones and wireless communication equipment.
|
| High Frequency use High-Q(Non Magnetic core) QF |
|
 |
ELJQFxxxxF
|
1.0nH to 39nH
|
400 to 150
|
1.2.Capable of being Re-flow or flow soldered.
2.Unique Ceramic Core/Laser-cut Technology.
3.Non polarity product.
4.High self resonance frequency.
5.Good for mounting.
|
| General use FC/FA/FB |
|
 |
ELJFAxxxxFx
ELJFBxxxxFx
ELJFCxxxxFx
|
1.(Type:FC) 0.22microH to 100microH
2.(Type:FA) 0.22microH to 220microH
3.(Type:FB) 0.22microH to 1000microH
|
1.(Type:FC) 190 to 60
2.(Type:FA) 360 to 45
3.(Type:FB) 700 to 40
|
1.General use wire wound, resin molded chip inductor.
2.Capable of being Re-flow or flow soldered.
3.Wide line-up from 2520 to 4532 case sizes.
4.Good for mounting.
|
1.AV equipment.
2.Wireless communication equipment and various types of general electronic eqipment.
|
| Higfh Power Type PF/PE/PC/PA/PB |
|
 |
ELJPAxxxxFx
ELJPBxxxxFx
ELJPCxxxxFx
ELJPExxxxFx
ELJPFxxxxFx
|
1.(Type:PF) 2.2nH to 10nH
2.(Type:PE) 2.2microH to 22microH
2.(Type:PC) 1.0microH to 33microH
4.(Type:PA) 1.0microH to 330microH
5.(Type:PB) 10microH to 220microH
|
1.(Type:PF) 1900 to 750
2.(Type:PE) 2100 to 700
3.(Type:PC) 475 to 120
4.(Type:PA) 600 to 50
5.(Type:PB) 360 to 90
|
1.Low DCR and large current capability , suitable for power circuitry.
2.Wire wound resin molded chip inductor. (PC,PA,PB type)
3.Unique Ceramic Core/Laser-cut Technology. (PF,PE type)
4.Capable of being Re-flow or flow soldered.
5.Wide line-up from 1005 to 4532 case sizes.
6.Good for mounting.
|
1.AV equipment
2.Wireless communication equipment and various general electronic eqipment.
|
| Shielded Type SC/SA |
|
 |
ELJSAxxxxFx
ELJSCxxxxFx
|
1.(SC Type)27microH to 100microH
2.(SA Type)10microH to 270microH
|
1.(SC Type)18 to 10
2.(SA Type)18 to 5
|
1,Magnetic shield effect using ferrite mixed within outermolding.
2.Capable of being Re-flow or flow soldered.
3.Good for mounting.
|
| Low DC Resistance Type EA |
|
 |
ELJEAxxxxF
|
1.0microH to 330microH
|
500 to 30
|
1,Low DCR ,suitable for power circuitry.
2.Magnetic shield effect using ferrite mixed outer molding.
3.Capable of being Re-flow or flow soldered.
4.Good for mounting.
|
Panasonic Global
-
