| Series/Type |
Catalog |
Style |
Parts No |
Inductance range |
DC current |
Features |
Recommended Applications |
Information on RoHS compliance |
Related Information |
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max.(mA) |
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 High Freq.Use(Non magnetic) RF/RE/ND/NC/NA |
 |
 |
ELJNAxxxxF
ELJNCxxxxF
ELJNDxxxxF
ELJRExxxxFA
ELJRFxxxxFB
|
(Type:RF) 1.0nH to 100nH
(Type:RE) 1.0nH to 220nH
(Type:ND) 10nH to 1000nH
(Type:NC) 10nH to 820nH
(Type:NA) 47nH to 8200nH
|
(Type:RF) 400 to 90
(Type:RE) 500 to 70
(Type:ND) 540 to 120
(Type:NC) 280 to 100
(Type:NA) 450 to 60
|
1.High frequency capability due to its non magnetic core.
2.Capable of being Re-flow or flow soldered.
3.Wide line-up from 1005 to 3225 case sizes.
4.Good for mounting.
|
1.RF circuitry for cellular phones and wireless communication equipment.
|
RoHS compliant (Please refer to the Related Information.)
|
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| High Frequency use High-Q(Non Magnetic core) QF,QE |
|
 |
ELJQExxxxFA
ELJQFxxxxF
|
(Type:QF)1.0nH to 39nH
(Type:QE)2.2nH to 56nH
|
(Type:QF)400 to 150
(Type:QE)970 to 180
|
1.2.Capable of being Re-flow or flow soldered.
2.Unique Ceramic Core/Laser-cut Technology.
3.Non polarity product.
4.High self resonance frequency.
5.Good for mounting.
|
|
| General use FC/FA/FB |
|
 |
ELJFAxxxxFx
ELJFBxxxxF
ELJFCxxxxF
|
(Type:FC) 0.22microH to 100microH
(Type:FA) 0.22microH to 220microH
(Type:FB) 0.22microH to 1000microH
|
(Type:FC) 190 to 60
(Type:FA) 360 to 45
(Type:FB) 700 to 40
|
1.General use wire wound, resin molded chip inductor.
2.Capable of being Re-flow or flow soldered.
3.Wide line-up from 2520 to 4532 case sizes.
4.Good for mounting.
|
1.AV equipment
2.Wireless communication equipment and various types of general electronic eqipment.
|
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| High Power Type PF/PE/PC/PA3/PA2/PB/LC/LA |
|
 |
ELJLAxxxKF
ELJLCxxxxF
ELJPAxxxxF
ELJPAxxxxF2
ELJPBxxxxF
ELJPCxxxxF
ELJPCxxxxF3
ELJPExxxxFx
ELJPFxxxxFx
|
(Type:LA) 2.2 to 100 microH
(Type:LC) 2.2 to 10 microH
(Type:PA) 1.0 to 330 microH
(Type:PA2) 1.0 to 220 microH
(Type:PB) 10 to 220 microH
(Type:PC) 1.0 to 33 microH
(Type:PC3) 1.0 to 22 microH
(Type:PE) 2.2nH to 22nH
(Type:PF) 2.2nH to 10nH
|
(Type:LA) 740 to 110
(Type:LC) 520 to 240
(Type:PA) 600 to 50
(Type:PA2) 1150 to 115
(Type:PB) 360 to 90
(Type:PC) 475 to 120
(Type:PC3) 890 to 275
(Type:PE) 2100 to 700
(Type:PF) 1900 to 750
|
1.Low DCR and large current capability , suitable for power circuitry.
2.Wire wound resin molded chip inductor. (PC,PA,PB type)
3.Unique Ceramic Core/Laser-cut Technology. (PF,PE type)
4.Capable of being Re-flow or flow soldered.
5.Wide line-up from 1005 to 4532 case sizes.
6.Good for mounting.
New products: Serise ELJLC/ELJLA
|
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| Shielded Type SC/SA |
|
 |
ELJSAxxxxFx
ELJSCxxxxFx
|
(SC Type)27microH to 100microH
(SA Type)10microH to 270microH
|
(SC Type)18 to 10
(SA Type)18 to 5
|
1,Magnetic shield effect using ferrite mixed within outermolding.
2.Capable of being Re-flow or flow soldered.
3.Good for mounting.
|
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| Low DC Resistance Type EA |
|
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ELJEAxxxxF
|
1.0microH to 330microH
|
500 to 30
|
1,Low DCR ,suitable for power circuitry.
2.Magnetic shield effect using ferrite mixed outer molding.
3.Capable of being Re-flow or flow soldered.
4.Good for mounting.
|
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| Signal Processing Use (Low distortion type), DA and FA***D |
|
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ELJDA101JF
ELJDA390JF
ELJDA470JF
ELJDA560JF
ELJDA680JF
ELJDA820JF
ELJFA101JFD
ELJFA390JFD
ELJFA470JFD
ELJFA560JFD
ELJFA680JFD
ELJFA820JFD
|
39microH to 100microH
|
(Type DA) 70,80,85,100,105,110
(Type FA***D) 70,75,85,95,100,105
|
1.General use wire wound and resin molded chip inductor.
2.Low distortion type suitable for Signal processing.
3.2 line-up of Super low distortion series and low distortion type.
4.Good mounting characteristic.
|
1.All kinds of Broadband Modem, Router and STB etc.
2.Corresponds to sam IC chipset
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