Industrial Solutions

Passive&Electromechanical-Chip Inductors

Terms and Conditions Terms and Conditions
Series/Type Catalog Style Parts No Inductance range DC current Features Recommended Applications RoHS
- - - - - max.(mA) - - -
High Freq.Use(Non magnetic) RF/RE/ND/NC/NA PDF(267KB) High Freq.Use(Non magnetic) RF/RE/ND/NC/NA ELJNAxxxxF
ELJNCxxxxF
ELJNDxxxxF
ELJRExxxxFA
ELJRFxxxxFB
1.(Type:RF) 1.0nH to 100nH
2.(Type:RE) 1.0nH to 220nH
3.(Type:ND) 10nH to 1000nH
4.(Type:NC) 10nH to 820nH
5.(Type:NA) 47nH to 8200nH
1.(Type:RF) 400 to 90
2.(Type:RE) 500 to 70
3.(Type:ND) 540 to 120
4.(Type:NC) 280 to 100
5.(Type:NA) 450 to 60
1.High frequency capability due to its non magnetic core.
2.Capable of being Re-flow or flow soldered.
3.Wide line-up from 1005 to 3225 case sizes.
4.Good for mounting.
1.RF circuitry for cellular phones and wireless communication equipment.
for RoHS
High Frequency use High-Q(Non Magnetic core) QF PDF(97KB) High Frequency use High-Q(Non Magnetic core) QF ELJQFxxxxF
1.0nH to 39nH
400 to 150
1.2.Capable of being Re-flow or flow soldered.
2.Unique Ceramic Core/Laser-cut Technology.
3.Non polarity product.
4.High self resonance frequency.
5.Good for mounting.
General use FC/FA/FB PDF(193KB) General use FC/FA/FB ELJFAxxxxFx
ELJFBxxxxFx
ELJFCxxxxFx
1.(Type:FC) 0.22microH to 100microH
2.(Type:FA) 0.22microH to 220microH
3.(Type:FB) 0.22microH to 1000microH
1.(Type:FC) 190 to 60
2.(Type:FA) 360 to 45
3.(Type:FB) 700 to 40
1.General use wire wound, resin molded chip inductor.
2.Capable of being Re-flow or flow soldered.
3.Wide line-up from 2520 to 4532 case sizes.
4.Good for mounting.
1.AV equipment.
2.Wireless communication equipment and various types of general electronic eqipment.
Higfh Power Type PF/PE/PC/PA/PB PDF(208KB) Higfh Power Type PF/PE/PC/PA/PB ELJPAxxxxFx
ELJPBxxxxFx
ELJPCxxxxFx
ELJPExxxxFx
ELJPFxxxxFx
1.(Type:PF) 2.2nH to 10nH
2.(Type:PE) 2.2microH to 22microH
2.(Type:PC) 1.0microH to 33microH
4.(Type:PA) 1.0microH to 330microH
5.(Type:PB) 10microH to 220microH
1.(Type:PF) 1900 to 750
2.(Type:PE) 2100 to 700
3.(Type:PC) 475 to 120
4.(Type:PA) 600 to 50
5.(Type:PB) 360 to 90
1.Low DCR and large current capability , suitable for power circuitry.
2.Wire wound resin molded chip inductor. (PC,PA,PB type)
3.Unique Ceramic Core/Laser-cut Technology. (PF,PE type)
4.Capable of being Re-flow or flow soldered.
5.Wide line-up from 1005 to 4532 case sizes.
6.Good for mounting.
1.AV equipment
2.Wireless communication equipment and various general electronic eqipment.
Shielded Type SC/SA PDF(107KB) Shielded Type SC/SA ELJSAxxxxFx
ELJSCxxxxFx
1.(SC Type)27microH to 100microH
2.(SA Type)10microH to 270microH
1.(SC Type)18 to 10
2.(SA Type)18 to 5
1,Magnetic shield effect using ferrite mixed within outermolding.
2.Capable of being Re-flow or flow soldered.
3.Good for mounting.
Low DC Resistance Type EA PDF(74KB) Low DC Resistance Type EA ELJEAxxxxF
1.0microH to 330microH
500 to 30
1,Low DCR ,suitable for power circuitry.
2.Magnetic shield effect using ferrite mixed outer molding.
3.Capable of being Re-flow or flow soldered.
4.Good for mounting.