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    Metallized 2-Layers of Copper + Nickel + Conductive Adhesion Agent

    EYJB(D) type

    • Strengthened grand performance by attaching conductive adhesion agent with the thickness of 35µm on the metallized side of EYJB(B) type.
    • Both roll(maximum width: 120mm) and Piercing processing are available.

    Feature

    • -Pressure adhered at normal temperature.
    • -Excellent conductivity and long-term secure adhesive strength.
    • -High accurate Piercing processing.

    Structure

    Shield Characteristics

    Example of Use

    • -Shield Film for Mobile Devices(LCD Chassis, Isolator, etc.)
    • -Shield Film for Flat Cable
    • -Conductive Tape

    Example of product specification

    Example of order product number