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Production Modular : Configurable modules allow flexible line setupProcess Units

NPM-D2

Features
Solder Inspection (SPI) • Component Inspection (AOI) - Inspection head

Solder Inspection

  • Solder appearance inspection

Mounted component
Inspection

  • Appearance inspection of mounted components

Pre-mounting foreign
object*1 inspection

  • Pre-mounting foreign object inspection of BGAs
  • Foreign object inspection right before sealed case placement

*1:Foreign object is available to chip components.

SPI and AOI
automatic switching

  • Solder and component inspection is switched automatically according to production data.

Unification of inspection
and placement data

  • Centrally managed component library or coordinate data does not require two data maintenance of each process.

Automatic link to quality information

  • Automatically linked quality information of each process assists your defect cause analysis.
Adhesive Dispensing - Dispensing head

Screw-type discharge mechanism

  • Panasonic's NPM has the conventional HDF discharge mechanism, which ensures the high-quality dispensing.
  • Supports various dot/drawing dispensing patterns

 

  • High accuracy sensor (option) measures local PCB height to calibrate dispensing height, which allows for non-contact dispensing on PCB.
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