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    IPAC-DS/DU

    Features
    More Infomation
    Realization of high productivity
    High productivity achieved by elimination of head waiting time with the dual lane/dual head concept.
    For 570 ml (20 oz.) syringe specifications (option), the constant-viscosity support system has been built into the material supply unit, maintaining high accuracy and reducing down time for material replenishment.
    Wide range of material/application coverage with 2 dispense head types.
    Selection of dispense heads allows dispensing of a high viscosity sealant to a low viscosity underfill material.
    Straight and curved lines can be drawn with the Continuous Path control.
    Realization of stable application by automatic correction.
    Auto correction of nozzle-substrate position with the height sensor allows steady dispensing.
    Weight monitoring system calibrates dispensing volume automatically and maintains volume accuracy. (option)
    Specfication
    Model ID IPAC-DS IPAC-DU
    Model No. *1 NM-EJM4C, NM-MH20 NM-EJM5C, NM-MH30
    Carrier dimensions (mm) *2 L 220 x W 29 to L 323 x W 146
    Usage Sealant Underfill
    Pump structure Auger pump Linear pump
    Material supply (standard) 170 ml (6 oz.) syringe
    Electric source 3-phase AC 200 / 208 / 380 / 415 / 480 V, 1.5 kVA 3-phase AC 200 / 208 / 380 / 415 / 480 V, 5.5 kVA *4
    Pneumatic source 0.49 MPa, 60 L/min (A.N.R.)
    Dimensions (mm) *3 W 980 x D 1 660 x H 1 650
    Mass 1 750 kg (Only for main body)
    *1 : For the IPAC-DS, you can choose between the NM-EJM4C model (CE mark) as a safety standard and the NM-MH20 model (SEMI Standards). For the IPAC-DU, you can choose between the NM-EJM5C model (CE mark) as a safety standard and the NM-MH30 model (SEMI Standards).
    *2 : Board transport by the carrier is assumed as a standard. In case PCB L is larger than 200 mm, work area will be divided into a right and left head.
    *3 : Excluding monitor and signal tower.
    *4 : Main PCB-heating stage : when option is used.
    * Please refer to the “Specification” booklet for details.