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    IPAC-DA/FW

    Features
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    Realization of high accuracy / high productivity through the high-rigid platform with dual lanes / dual heads.
    IPAC series uses a high rigidity platform with superb damping capability designed through CAE and thermal analysis.
    Newly developed thermal compensation feature maintains high accuracy bonding during heated processes.
    Dual lane concept maintains the high throughput is by eliminating the wait time of the bond head during substrate transfer.
    Dual Heads alternatively pick die from a single wafer minimizing bond head wait time.
    Realization of thin die bonding with our original pickup method that supports ø300 mm wafers.
    This machine supports SEMI-compliant ø300 mm wafer supply (option). (Supplied from the front of the machine)
    The combination of our unique ejector mechanism (option) and low-load pickup nozzles provides the damage-less pickup of thin dice.
    * The magazine for wafer frames must be prepared by you.
    Support for various bare chip processes with the combination of various method units.
    The combination of the high-accuracy 3-nozzle head equipped with load control, the PCB heater(option) allows to support various bare chip processes suitable for your products.
    Reversing process can be changed by model type data, and a flip chip placer can also be used for die attach process.
    Specfication
    Model ID IPAC-DA IPAC-FW
    Model No. *1 NM-EJM6C, NM-MH50 NM-EJM8C, NM-MH80
    Carrier dimensions (mm) *2 L 220 x W 29 to L 323 x W 146
    Productivity 4 000 cph (dry cycle) 3 000 cph (dry cycle)
    Bonding accuracy XY ±25 µm (Cpk1) XY ±10 µm (Cpk1) *4
    Die dimensions (mm) L 5 mm x W 5 mm to L 20 mm x W 20 mm, Please consult about less than 5 mm
    Die supply method ø300 mm (option) / ø200 mm wafer
    Electric source 3-phase AC 200 / 208 / 380 / 415 / 480 V, 5.8 kVA
    Pneumatic source 0.49 MPa, 100 L/min (A.N.R.)
    Vacuum source -0.093 MPa, 300 L/min (A.N.R.) 1 line and 200 L/min (A.N.R.) 1 line,
    A vacuum source needs to be arranged by the customer.
    Dimensions (mm) *3 W 980 x D 2 285 x H 1 650
    Mass 2 060 kg (Only for main body) 2 100 kg (Only for main body)
    *1 : For the IPAC-DA, you can choose between the NM-EJM6C model (CE mark) as a safety standard and the NM-MH50 model (SEMI Standards). For the IPAC-FW, you can choose between the NM-EJM8C model (CE mark) as a safety standard and the NM-MH80 model (SEMI Standards).
    *2 : Board transport by the carrier is assumed as a standard.
    *3 : Excluding the operation panel and signal tower.
    *4 : Pattern matching with a C4 camera
    * Values such as productivity,bonding accuracy may vary depending on operational conditions.
    * Please refer to the "Specification" booklet for details.