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    IPAC-CS/SP

    Features
    More Infomation
    Flexibility to manufacturing volume fluctuations.
    Compact equipment size allows easy addition/removal of equipment to cope with the volume fluctuations.
    The machine as standard supports carriers generally used in semiconductor process.
    Compact body for a high area productivity.
    Adopting the high-speed 18-nozzle head achieves higher speed placement for micro chips.(IPAC-CS TypeB)
    Dual Head/Dual Lane in a 980 mm compact body for high area productivity.
    The motor-driven tape feeder* and tape splicing jig enables long and continuous operation.
    Adopting the dual lanes and dual heads reduces the wait time of the head during board transport and raises the actual productivity by about 30% (compared with the case where the single lane is used).
    * The motor type excludes the IPAC-CS (Type B)
    Highly accurate, high quality placement.
    The 2D sensor equipped with CMOS components realizes highly accurate placement.
    Full closed loop servo control w/linear scales for high precision.
    Specfication
    Model ID IPAC-CS IPAC-SP
    Model No. *1 NM-EJM2C,NM-MH00 NM-EJM3C,NM-MH10
    Type Type A Type B *4 -
    No.of nozzles 10 nozzles x 2 heads 18 nozzles x 2 heads 10 nozzles x 2 heads
    Carrier dimensions (mm) *2 L 220 x W 29 to L 323 x W 146
    Max.speed 0.1 s/chip 0.079 s/chip *5 0.3 s
    (with a solder plate of L 12 mm x W 12 mm x T 0.35 mm)
    Placement accuracy ±50 µm/chip (Cpk1) ±127 µm/solder plate (Cpk1)
    No.of component inputs 24 (when using an 8 or 12 mm tape),
    12 (when using a 16 or 24 mm tape)    		 24 (when using an 8 mm tape) 12 (When using a 24 or 32 mm tape),
    8 (When using a 44 mm tape)
    48 (when using an 8 mm tape in the double tape feeder)
    Applicable components (mm) (0201") 0603 chip to L 6 x W 6 x T 5.5 (01005") 0402 chip to L 3.2 x W 1.6 x T 2.0 Component dimensions
    L 12 x W 12 to L 35 x W 35
    Component thickness
    T 0.31 to T 0.35
    Electric source 3-phase AC 200 / 208 / 380 / 415 / 480 V, 2.5 kVA
    Pneumatic source 0.49 MPa, 60 L/min (A.N.R.)
    Vacuum source -0.093 MPa, 330 L/min (A.N.R.) A vacuum pump : optional
    Dimensions (mm) *3 W 980 x D 1 660 x H 1 650
    Mass 1 750 kg (Only for main body)
    *1 : For the IPAC-CS, you can choose between the NM-EJM2C model (CE mark) as a safety standard and the NM-MH00 model (SEMI Standards). For the IPAC-SP, you can choose between the NM-EJM3C model (CE mark) as a safety standard and the NM-MH10 model (SEMI Standards).
    *2 : Board transport by the carrier is assumed as a standard.
    *3 : Excluding the operation panel, tape feeder, and signal tower.
    *4 : The type B requires a special tape feeder.
    *5 : 01005"(0402) chips can be placed with 0.12 s/chip due to individual pick-up.
    * Values such as maximum speed and placement accuracy may vary depending on operating conditions.
    * Please refer to the "Specification" booklet for details.