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    IPAC-CA

    Features
    More Infomation
    Realization of high accuracy / high productivity through the high-rigid platform with dual lanes / dual heads.
    IPAC series uses a high rigidity platform with superb damping capability designed through CAE and thermal analysis.
    Newly developed thermal compensation feature maintains high accuracy bonding.
    Duel lane concept maintains the high throughput is by eliminating the wait time of the bond head during substrate transfer.
    Support for a wide range of components with a combination of two feeding methods.
    Four types of products are available in a combination of tape feeders and tray feeders (optional).
    Support for various flip chip processes with the combination of various method units.
    The combination of the high-accuracy 3-nozzles head equipped with load control and the flux transfer unit (optional) allows to support various flip chip processes suitable for your products.
    Specfication
    Model ID IPAC-CA
    Model No. *1 NM-EJM7C,NM-MH60
    Carrier dimensions *2 (mm) L 220 x W 29 to L 323 x W 146
    Productivity 6 000 cph (2D camera) / 4 500 cph (C4 camera : optional )
    Placement accuracy Chip : XY ±50 µm (2D camera)
    C4 : XY ±25 µm (2D camera)
    C4 : XY ±10 µm (C4 camera : optional)
    No.of component inputs Taped component feeding :
    Max. 48 (when using an 8 mm tape in the double feeder)
    Tray-packaged component feeding :
    Max. 6 (when using an 2" in the tray feeder)
    Applicable components SMT : (0201”) 0603 chip to L 5 mm x W 5 mm x T 5 mm
    C4 : L 3 mm x W 3 mm to L 35 mm x W 35 mm
    Electric source 3-phase AC 200 / 208 / 308 / 415 / 480 V, 2.5 kVA
    Pneumatic source 0.49 MPa, 100 L/min (A.N.R.)
    Vacuum source -0.093 MPa, 300 L/min (A.N.R.), A vacuum source needs to be arranged by the customer.
    Dimensions (mm) *3 W 980 x D 1 660 x H 1 650
    Mass 1 800 kg (Only for main body)
    *1 : For the IPAC-CA, you can choose between the NM-EJM7C model (CE mark) as a safety standard and the NM-MH60 model (SEMI Standards).
    *2 : Board transport by the carrier is assumed as a standard.
    *3 : Excluding the operation panel, feeder, and signal tower.
    * Values such as productivity, placement accuracy may vary depending on operational conditions.
    * Please refer to the "Specification" booklet for details.