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SMD/Semiconductor Assembly
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High area productivity with the dual lane / dual head concept
By teaming up with Asymtek, state-of-the-art dispensers have been developed
Supports various bare chip processes with the combination of various method units
High productivity and high-accuracy mixed plecement
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Electronic Component Mounting
SMD/Semiconductor Assembly
IPAC-CS/SP
IPAC-DS/DU
IPAC-DA/FW
IPAC-CA
Microelectronics Bonding
Dry Etching
Ultrahigh Accurate 3-D Profilometer
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