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    FA top FA Products
    Company Profile Catalog Data in Chinese FA Exhibition
    Dry Etching
    SEM Photos by Material and Device
    SEM Photo by Material and Device About Plasma Sources

     



    		 Device
    SMD 3-Dimensional packaging technology
    Via ectching    		 Silicon LSI Compound semiconductor
    MEMS
    Automotive
    SAW     		Power
    CMOS
    FeRAM    		 LED device
    High-speed device
    Optical device
    Material Deep Si click click click
    Poly-Si     click
    Al click   click
    Al (thick)
    		 click
    SiO2 click click click click
    Silicide   click
    SiN   click click
    GaAs   click
    InP   click
    Pt, Ir, PZT,
    Ni compound    		 click click
    Au click click
    Polyimide   click
    W click
    Cu click    

    It is supported difficult-to-process such as quartz, crystal, SIC, sapphire, and so on.
    Quartz: 0.5μm/min
    SIC: 3.1μm/min