Multi-generation module (MGM) system
This dry etching system makes it possible to handle a wide range of product generations and many types of products by replacing the electro unit that has been used by Panasonic up to now.
Saved space
Compact machine size has been achieved by unifying the control unit into the main body. The installation space is 3.6m2 and the main body width is 1 000 mm.
Highly reliable mechanism
Synchronized transfer mechanism with all-cam drive is adopted to transfer the wafer. The drive hardly ever malfunctions, even if the operation is irregular or there is a power failure.
Model ID
E620
E620-MK3
Wafer size
3 ~ 8 inch
6 ~ 8 inch
Residence time
0.0414 s
0.013 s
Plasma source
Multi-spiral-coil type ICP / RIE
Multi-spiral-coil type ICP
Etching film
WSi, Poly-Si,
Si, Silicide,
S trench,
SiO2, SiN,
GaAs etc.
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