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The reason why an extra-thin gold plated electrode can be used
When a extra-thin gold plated electrode is used, nickel compounds are formed on a surface after the heat treatment by the die-bonding cure. These nickel compounds impair the wire bonding performance, thus it is said that a thin gold plated electrode is unsuitable for wire bonding. However, the argon plasma treatment eliminates the nickel compounds, therefore stable wire bonding can be performed on an extra-thin and extra-cheap gold plated electrode. |
Surface reforming by oxygen plasma
Surface reforming by oxygen radical improves mold resin adhesion and under-fill wettability. (Option) |
Transfer system options
M type
M type transfer system, loader, and unloader |
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S type
S type transfer system, loader, and unloader |
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| Model ID |
PSX307 |
| Model No. |
NM-EFP1A |
| Cleaning methed |
Parallel plate RF back-sputtering method |
| Gas for electrical discharge *1 |
Ar [option : O2] |
| Substrate dimensions (mm) |
L 50 x W 20 to L 250 x W 75 *2 incl. S type option
L 50 x W 20 to L 330 x W 120 incl. M type option |
| Substrate thickness (mm) |
0.5 to 2.0 |
| Dimensions (mm) / Mass *3 |
W 930 x D 1100 x H 1 450 / 555 kg
W 1 764 x D 1 100 x H 1 450 / 850 kg incl. S type option
W 1 764 x D 1 100 x H 1 450 / 770 kg incl. M type option |
| Power source *4 |
1-phase AC 200 V, 2.00 kVA [Full Load 5.00 kVA] |
| Pneumatic source |
0.49 MPa or more, 6.5 L/min [A.N.R.] |
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*1: If the optional oxygen gas is selected as a discharge gas, nitrogen gas is also required to dilute exhaust.
*2: For W 70.1mm to W 75mm, the electrode in the chamber is required separately.
*3: Tolerance of equipment dimensions is ±5mm, Touch panel and condition lamp is not included. Mass varies depending on configuration.
*4: Compatible with 1-phase 208/220/230/240 V
*Please refer to the specifications on details. |
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