Industrial Solutions
FA top FA Products
Company Profile Catalog Data in Chinese FA Exhibition
Fine Device Bonding / Microelectronic Bonding / Equipment that realizes high-quality fine bonding of bare chips
Die Bonder Plasma Cleaner Flip Chip Bonder Bonder for FPD

Plasma Cleaner / Equipment that enables ultra-thin gold plated electrodes to be used for wire bonding via argon plasma treatment
1.5 times the productivity of conventional models