Industrial Solutions
FA top FA Products
Company Profile Catalog Data in Chinese FA Exhibition
Fine Device Bonding / Microelectronic Bonding / Equipment that realizes high-quality fine bonding of bare chips
Die Bonder Plasma Cleaner Flip Chip Bonder Bonder for FPD

Flip Chip Bonder / Equipment to bond bare chips with bumps on electrodes

1.8 s/IC Wide Range of Process
For the mass production of compact high-frequency electronic components