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Fine Device Bonding
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Equipment to bond bare chips on substrates or leadframes
Equipment to clear surfaces by the molecule level utilizing plasma
Equipment to clear surfaces by the molecule level utilizing plasma
Equipment to bond bare chips with bumps on electrodes
Equipment to bond the driver ICs on liquid crystal panels with high accuracy
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Electronic Component Mounting
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Die Bonder
Plasma Cleaner
Plasma Dicer
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Dry Etching
Ultrahigh Accurate 3-D Profilometer
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