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| Further evolution of accurate component placement from microchips to BGAs and CSPs. The rigid, low-vibration die-cast frame, reduced weight reduction of placement head, the vibration reduction of the rotary head and X-Y table allow a placement accuracy of 50 µm/3  .Switching of placement blow timing with every placement speed and nozzle ensures placement under optimum conditions and improves placement quality. Control of component placement height with the high-accuracy line sensor ensures high-quality placement. Recognition camera with multiple view, reflective and transmissive component recognition and coaxial reflective lighting provide high-accuracy recognition and precision placement of components from (0201") 0603 microchips to L 24 mm x W 24 mm QFPs. |
| Compatible with high productivity 18 placement heads (6 nozzles) allow maximum placement speed of 0.066 s/chip (54 500 cph) Increased speed of the X-Y table realizes high productivity. Using the top tape batch removal cap at the tape feeder shortens component exchange time. Double tape feeder allows loading of up to 300 different components. IPC* enables component recognition automation and reduction of equipment stoppage loss. Rotary Magnet(RM)system bulk feeder* allows high-speed aligned reliable feeding and long-term uninterrupted operation. *Option |
| Improvement of productivity Touch panel allows easy operation. Cutting down the number of recognition algorithm component assortments to seven groups, that do all the 100 kinds of jobs as before, allows easy assortment selection. Convenient, complete library creation method. • Wizard system based on database search and diagrams. • Automatic instruction method that teaches and conveys component data. |
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Panasonic Global
