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    Panasonic Factory Solutions>[Electronic Component Mounting] Placement Machine>CM602-L
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    Electronic Component Mounting / PCB Assembly / Equipment and system software for realizing a high-density surface mountingPlacement Machine

    CM602-L

    Features
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    Wide range of variations
    The most suitable module can be selected to place components from microchips to odd-shaped components, as well as depending on the products and the production volume.
    *Heads can be changed after purchase.
    High-speed 12 nozzles - A wider range of components
    Our high-speed head (12 nozzles) expands component range by 240% so that the head has the capability of placing from micro chips to 12 mm square components at high speed.
    High-flexibility 8 nozzles - Component support enhancement
    Our high-flexibility head (8 nozzles) can increase production capability through nozzle replacement during operation.
    The 8-nozzle head can place 32mm square large-sized components at high speed.
    Improves area productivity with compact feeder carts
    Improves actual productivity by new optimization
    8 Manufacturing sequence optimization has increased IPC9850 productivity by 8% compared to the former model.
    High-quality placement for IC component via the 3D sensor
    High-speed detection via batch scanning.
    Chip thickness measuring sensor Quality enhancement
    Multifunctional transfer unit supporting POP and C4
    Highly versatile unit accurately transfers solder/flux for POP top packaging/C4 mounting on the bump side
    Quick changeover capabilities
    High modular compatibility
    High compatibility with CM402 series realized through modular manufacturing concept.
    Specfication
    Model ID CM602-L
    Model No. NM-EJM8A
    PCB dimensions (mm) L 50 x W 50 to L 510 x W 460
    High-speed head 12 nozzles
    Max.speed 0.036 s/chip (Type A-2)
    Placement accuracy ±40 µm/chip (Cpk1)
    Component dimensions (mm) (01005") 0402 chip *6 to L 12 x W 12
    High-speed head 8 nozzles
    Max.speed 0.048 s/chip (Type A-0)
    Placement accuracy ±40 µm/chip, ±35 µm/QFP 24 mm ~ 32 mm,
    ±50 µm/QFP <24 mm (Cpk1)
    Component dimensions (mm) (0201") 0603 chip to L 32 x W 32
    Multi-functional head 3 nozzles
    Max.speed 0.18 s/QFP (Type B-0)
    Placement accuracy ±35 µm/QFP (Cpk 1)
    Component dimensions (mm) (0201") 0603 chip to L 100 x W 90
    PCB exchange time 0.9 s (Board length:up to 240 mm Under optimum conditions)
    Electric source *1 3-phase AC 200 V, 4.0 kVA
    Pneumatic source *2 0.49 MPa, 170 L /min(A.N.R.)
    Dimensions (mm) W 2 350 x D 2 690 *3 x H 1 430 *4
    Mass *5 3 400 kg
    *1:Compatible with 220 / 380 / 400 / 420 / 480 V
    *2:Only for main body
    *3:Dimension D including direct tray feeder : 2 565 mm
    *4:Excluding monitor and signal tower
    *5:Standard configuration:excluding batch exchange cart and tray feeders. This may differ depending on configuration.
    *6:The 0402 chip requires a specific nozzle/feeder.
    *Values such as Max.speed and placement accuracy may vary depending on operating conditions.
    *Please refer to the "Specification" booklet for details.