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    Panasonic Factory Solutions>[Electronic Component Mounting]>CM232-M
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    Electronic Component Mounting / PCB Assembly / Equipment and system software for realizing a high-density surface mountingPlacement Machine

    CM232-M

    Features
    More Infomation
    A wide range of variations
    The most suitable module can be selected to place components from microchips to odd-shaped components, as well as depending on the products and the production volume.
    *Heads can be changed after purchase.
    Productivity enhancement with high-speed XY drive
    High-speed 12-nozzles heads with high-speed XY drive enable conventional equipment to increase productivity by up to 13 %.
    The heads provide high speed placement of components from microchips up to 12 mm square.
    High-flexibility 8-nozzle heads supporting direct tray feeders
    The new high-flexibility 8-nozzle heads with direct tray feeders support full-size trays and provide high speed placement of tray components.
    Improves area productivity with compact feeder carts
    High-quality placement for IC component via the 3D sensor
    High-speed detection via batch scanning.
    Chip thickness measuring sensor / Quality enhancement
    Quick changeover capabilities
    High modular compatibility
    High compatibility with CM402 series , CM602 , CM212 realized through modular manufacturing concept.
    Specfication
    Model ID CM232-M
    Model No. NM-EJM9C
    PCB dimensions (mm) L 50 × W 50 to L 400 × W 250
    High-speed head 12 nozzles
    Max.speed 0.045 s/chip (Type A-2)
    Placement accuracy ±50 µm/chip (Cpk1)
    Component dimensions (mm) (01005”) 0402 chip *6 to L 12 × W 12
    High-flexibility head 8 nozzles
    Max.speed 0.058 s/chip (Type A-0) , 0.45 s/QFP (Type D-0 , D-2 , D-3)
    Placement accuracy ±50 µm/chip , ±35 µm/QFP 24 mm to 32 mm , ±50 µm/QFP 24 mm (Cpk1)
    Component dimensions (mm) (0201”) 0603 chip to L 32 x W 32
    Multi-functional head 3 nozzles
    Max.speed 0.75 s/QFP (Type E-1 , E-2)
    Placement accuracy ±35 µm/QFP (Cpk1)
    Component dimensions (mm) (0201”) 0603 chip to L 100 × W 90
    PCB exchange time 4.0 s (when nothing is placed on the reverse side of PC board)
    Electric source *1 3-phase AC 200 V, 2.7 kVA
    Pneumatic source *2 0.5 MPa, 150 L /min (A.N.R.)
    Dimensions (mm) W 2 150 mm x D 2 175 mm *3 x H 1 430 mm *4
    Mass *5 2 500 kg
    *1:Compatible with 220 / 380 / 400 / 420 / 480 V
    *2:Only for main body
    *3:Dimension D including direct tray feeder:2 290 mm
    *4:Excluding monitor and signal tower
    *5:Standard configuration:excluding batch exchange cart and tray feeders. This may differ depending on configuration.
    *6:The 0402 chip requires a specific nozzle/feeder.
    *Values such as maximum speed and placement accuracy may vary depending on operating conditions.
    *Please refer to the “Specification” booklet for details.