A wide range of variations
The most suitable module can be selected to place components from microchips to odd-shaped components, as well as depending on the products and the production volume.
*Heads can be changed after purchase.
Productivity enhancement with high-speed XY drive
High-speed 12-nozzles heads with high-speed XY drive enable conventional equipment to increase productivity by up to 13 %.
The heads provide high speed placement of components from microchips up to 12 mm square.
High-flexibility 8-nozzle heads supporting direct tray feeders
The new high-flexibility 8-nozzle heads with direct tray feeders support full-size trays and provide high speed placement of tray components.
Improves area productivity with compact feeder carts
High-quality placement for IC component via the 3D sensor
High-speed detection via batch scanning.
±50 µm/chip , ±35 µm/QFP 24 mm to 32 mm , ±50 µm/QFP 24 mm (Cpk1)
Component dimensions (mm)
(0201”) 0603 chip to L 32 x W 32
Multi-functional head
3 nozzles
Max.speed
0.75 s/QFP (Type E-1 , E-2)
Placement accuracy
±35 µm/QFP (Cpk1)
Component dimensions (mm)
(0201”) 0603 chip to L 100 × W 90
PCB exchange time
4.0 s (when nothing is placed on the reverse side of PC board)
Electric source *1
3-phase AC 200 V, 2.7 kVA
Pneumatic source *2
0.5 MPa, 150 L /min (A.N.R.)
Dimensions (mm)
W 2 150 mm x D 2 175 mm *3 x H 1 430 mm *4
Mass *5
2 500 kg
*1:Compatible with 220 / 380 / 400 / 420 / 480 V
*2:Only for main body
*3:Dimension D including direct tray feeder:2 290 mm
*4:Excluding monitor and signal tower
*5:Standard configuration:excluding batch exchange cart and tray feeders. This may differ depending on configuration.
*6:The 0402 chip requires a specific nozzle/feeder.
*Values such as maximum speed and placement accuracy may vary depending on operating conditions.
*Please refer to the “Specification” booklet for details.