A wide range of component
Ensures continuous productivity by placing components from (0201”) 0603 to L 55 mm × W 55 mm or L 150 mm × W 25 mm components on tape, reel and tray.
The BM221 & 231 offer productivity with up to 120 tape and 80 tray (JEDEC standard) inputs.
Quick changeover capabilities
Fast, accurate placement
The 8-nozzle vertical drive provides batch recognition and batch pick-up for components in variable heights. *It differs depending on the condition.
A variation of available options for the supply unit [BM221]
(Type A) Tray Feeder + Tape Feeder
(Type B) No supply unit
(Type C) Tape Feeder
(Type D) Hand setting tray
(Type E) Tape Feeder + Hand setting tray
3D camera (optional)
2D and 3D sensors are used to accurately place components ranging from microchips to L 55 mm x W 55 mm x T 25 mm, QFPs, BGAs and CSPs.
Chip thickness measuring sensor (optional)
The chip thickness senser measures the thickness of components to improve placement quality.
Direct tray support function
QFP and odd-shape components can be continuously supplied at high speed using twin-tray feeders. (BM221 and BM231 [Type A])
Also, a hand setting tray table can be selected. (BM221)
Model ID
BM123
BM133
Model No.
NM-EJM6B
NM-EJM7B
PCB dimensions (mm)
L 50 × W 50 to L 330 × W 250
L 50 × W 50 to L 510 × W 460
Max.speed
0.12 s/chip
Placement accuracy
± 50 µm/Chip (Cpk1), ± 30 µm/QFP (Cpk1)
No.of component inputs
80 (Double tape feeder : 160)
Component dimensions (mm) *1
(0201”) 0603 chip to L 32 × W 32 × T 15
PCB exchange time *2
2.5 s *6
5.0 s
Electric source
3-phase AC 200, 220, 380, 400, 420, 480 V 2.68 kVA
Pneumatic source
0.43 MPa,150 L/min(A.N.R.)
Dimensions (mm)
W 1 950 × D 1 500 *3 × H 1 500 *4
W 1 950 × D 1 710 *3 × H 1 500 *4
Mass *5
1 700 kg
1 800 kg
Model ID
BM221 (Type A)
BM231
Model No.
NM-EJM8B
NM-EJM1C
PCB dimensions (mm)
L 50 × W 50 to L 330 × W 250
L 50 × W 50 to L 510 × W 460
Max.speed
0.25 s/chip
Placement accuracy
± 50 µm/Chip (Cpk1), ± 30 µm/QFP (Cpk1)
No.of component inputs
60 (Double tape feeder:120), Tray?80
Component dimensions (mm) *1
(0201”) 0603 chip to L 150 × W 25 × T 25 or L 55 × W 55 × T 25
PCB exchange time *2
2.5 s
(High-speed transfer specification configuration,*6)
5.0 s
Electric source
3-phase AC 200, 220, 380, 400, 420, 480 V 2.68 kVA
Pneumatic source
0.43 MPa,150 L/min(A.N.R.)
Dimensions (mm)
W 1 950 × D 2 060 *3 × H 1 500 *4
W 1 950 × D 2 270 *3 × H 1 500 *4
Mass *5
2 000 kg
2 100 kg
*1:Varies depending on selectable Specifications.
*2:It varies depending on the specification of PCBs.
*3:Excluding batch exchange cart and tape feeder.
*4:Excluding recognition monitor and signal tower.
*5:Fixed component supply unit specification
When including a feeder cart : BM123 : 2 100 kg, BM133 : 2 200 kg, BM221 : 2 200 kg, BM231 : 2 300 kg
*6:When no components are placed on the back of the PCB.
*Values such as Max.speed and placement accuracy may vary depending on operating conditions.
*Please refer to the "Specification" booklet for details.
Panasonic Global
1), ± 30 µm/QFP (Cpk
