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| Support for micro-chips High resolution enables the inspection of solder printed for micro-chip. • A resolution of 10µm enables print inspection of very small solder amounts such as for micro-chips and fine pitch CSPs. • Height measurement accuracy is improved through the adoption of 4CH (2CH for previous machine) light-receiving system. • Lead-free solder inspection is also possible. |
| High-speed inspection improves productivity High-accuracy 3D sensor (high-speed laser scanning system) incorporated • The polygon mirror of high-speed rotation (7 times as compared with the previous machine)scans laser light to the PCB rapidly. • Even a large PCB can be produced according to line tact by high-speed inspection. *A PCB whose dimensions are 330 mm x 250 mm (M size)can be inspected in 20 µm resolution in 35 s (50% higher speed than before). |
| Operability improved through the automation of inspection program creation PCB Gerber data and metal mask Gerber data • By reading the circuit design data derived from the converted PCB Gerber data, ground can be registered automatically. • Solder data can be automatically registered from the converted Gerber data of metal mask. • The inspection program can be made by off-line*, so it is not necessary to stop the production line, and the start-up time of the new model can be shortened. *Option (Inspection program edit software) |
| Support for improvement in placement quality Real-time quality analysis function • Print quality can be prevented from declining by always monitoring solder printed conditions. Printing quality statistical analysis function • The defect counting and statistical processing can be carried out on the basis of accumulated measurement data, which enables the analyses* of print processes and improves print quality much more. *Option (Quality statistics software) |
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Panasonic Global
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