Main Contents begins from here.
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| Support for micro-chips High-resolution inspection for micro chip components • A resolution of 10µm enables inspection of micro-chips and components with fine-pitch placements. • A PCB is perpendicularly irradiated with a laser beam, and four PSDs eliminate blind spots between components. • Lead-free solder inspection is also possible. |
| High-speed inspection improves productivity High-speed 3D laser scanning system • The polygon mirror of high-speed rotation scans laser light to the PCB rapidly. • Even a large PC board can be produced according to line tact by high-speed inspection. • An M-size PC board (330 mm x 250 mm )can be inspected at “*35 seconds” at a resolution of 20 µm. * Longer tact time may be required depending on conditions such as the number of components, their arrangement and the number of marks. • The compact machine body increases area productivity. |
| Inspection program auto-creation function improvement Inspection program auto-creation from CAM data •Inspection program can be automatically created by grand auto-registration function with CAM data and image processing. •Inspection program can be automatically created without PC board Gerber. * The function of auto-creation using PC board Gerber is available. |
| Support for improvement in placement quality (Optional) Repair station • Storage of inspection results, support for repair work and accumulation of quality results are possible. • The functional advances and improvement in operability have been achieved as compared with the previous system. Analysis of placement quality • Quality analysis such as defect counting and statistical processing can be carried out from the accumulated inspection data. The improvements in quality of mounted PC board can be reflected easily. |
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