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    Electronic Component Mounting / PCB Assembly / Equipment and system software for realizing a high-density surface mountingAdhesive Dispenser

    HDF

    Features
    More Infomation
    Screw-type head ensures stable high-speed application
    The screw-type head enables high-speed application at 0.07 s/shot.
    Application is not affected by the amount of remaining adhesive, so productivity and quality are enhanced as there is no need for correction.
    Recommended adhesive : ADE820DX
    Please inquire about adhesives from other manufacturers.
    Versatility
    With three types of nozzles (VS, S, and L ), the amount of application can be set freely.
    With multiple-shot capability, components from (0603”) 1608 to large components can be handled.
    The application direction can be set in 1° increments between -90 ° and 89 °.
    Compact design fits in the space of the high-speed placement machine
    Fits within the area of the high-speed placement machine, achieving superior productivity.
    Application of solder/silver paste is also supported
    Technical check of samples is required. Please consult our sales person.
    Specfication
    Model ID HDF
    Model No. NM-DC10 NM-DC15
    PCB dimensions (mm) L 50 x W 50 to L 330 x W 250 L 50 x W 50 to L 510 x W 460
    Max.speed 0.07 s/shot
    Dispensing position repeatability (mm) ±0.1
    Application nozzles 3 types (VS,S,L)
    Component dimensions (0603”) 1608 to SOP, PLCC, QFP
    PCB exchange time 2.4 s 2.9 s
    Electric source *1 3-phase AC 200 V, 2 kVA
    Pneumatic source 0.5 MPa, 40 L/min (A.N.R.)
    Dimensions (mm) W 1 590 x D 770 x H 1 500 *2 W 1 930 x D 1 082 x H 1 500 *2
    Mass 900 kg 1 245 kg
    *1 : Excluding signal tower
    *2 : Only for main body
    *Values such as Max.speed and dispensing accuracy may vary depending on operating conditions.
    *Please refer to the “Specification” booklet for details.