Strengths of Panasonic display-related systems

High-quality and high-reliability mounting process solutions with the industry’s number-one track record

The FPD manufacturing process has a step of mounting a driver IC and FPC on a panel. This step requires a particularly high level of precision. Panasonic offers our time-tested high-quality and high-reliability mounting solutions and mass production systems that dependably manufacture conforming products.

Image: High-quality and high-reliability mounting process

Products

List by process and application

Display-related systems lineup by process and application


List by process and application

COG/FOP Dual-purpose Bonder FPX007CG/FP

COG/FOP Dual-purpose Bonder

FPX007CG/FP

By changing component supply units, four different bonding (COG/FOG/FOP/COP) enabled.

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COP/FOP Dual-purpose Bonder FPX007CG/FP2

COP/FOP Dual-purpose Bonder

FPX007CG/FP2

Equipped with advanced functions essential for flexible AMOLED production. The bonding quality and productivity cultivated through COG bonding for LCDs are also realized in COP/FOP bonding for OLEDs.

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FOG/FOF Dual-purpose Bonder FPX007FG/FF

FOG/FOF Dual-purpose Bonder

FPX007FG/FF

Flexible support for FOF mounting on TCP with panel flipping unit. Increases production quality in combination with our mounting inspection machine

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Impression Inspection Machine FPX007AI

Impression Inspection Machine

FPX007AI

High-speed inspection of all pins of flexible OLED panels. High-speed tracking AF and MBR detection method optimized for plastic panels.

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COGボンダー FPX105CG

COG Bonder

FPX105CG

COG bonding technology we have been developing realizes further bonding quality and productivity improvement and an advanced COG bonder that is easier to use.

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COG Bonder FPX005CG

COG Bonder

FPX005CG

COG bonder supporting two sides bonding of panels up to sizes of 1-inch to 7-inch.

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FPC Bonder FPX105FG

FPC Bonder

FPX105FG

Support wide range of FPC bonding from ones used for cellphones/smart phones to those for tablets or notebook PCs.

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Impression Inspection Machine FPX101AI

Impression Inspection Machine

FPX101AI

High-speed, high-accuracy inspection of COG/FOG mounting conditions of LCD and AMOLED panels. Equipped with an auto-focus camera to achieve an inspection speed time of 3 s/panel.

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Features of Panasonic display-related systems

IC/TCP bonders

IC/TCP bonding is available by changing the component supply units.
Our original fixed-point mounting (temporary bonding) ensures high-precision mounting.

COG/FOP Dual-purpose Bonder FPX007CG/FP

FPC bonders

Equipped with a universal tool for temporary bonding.
Highly adaptable to various shapes and sizes of FPCs

FOG/FOF Dual-purpose Bonder FPX007FG/FF

Impression inspection machines

High-speed, high-accuracy inspection of ACF bonding conditions of mounted components.
Capable of inspecting all mounted components and pins using a line scan camera

Impression Inspection Machine FPX101AI

Exhibition and Seminar Information

Exhibition and Seminar Information

Information on current seminars and exhibitions is posted here. Information on past seminars and exhibitions is also available.

View List of Exhibitions and Seminars

Custom Service

Maintenance solution

Maintenance solution

Panasonic provides reliable lifetime product support to customers ranging from installation to replacement.

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Demonstration centers for semiconductor-related systems

Mounting Center

Dry etching / Plasma dicing / plasma cleaning / Die bonding / Flip-chip bonding

  • Verification
  • Demonstration

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Library

Video library

Video library

You can view a list of product and business introduction videos.
We will be adding new videos as they become available.

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Feature stories about our technology


Mounting Machines and Proprietary Systems That Support Production of Let’s Note Computers

Mounting Machines and Proprietary Systems That Support Production of Let’s Note Computers

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Panasonic’s vision for a sustainable future

Initiatives for Mounting Machines under Panasonic Green Impact

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Inquiries

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