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April 25, 2011
Panasonic Electronic Devices Co., Ltd.
Panasonic Enhances its Lineup of ALIVH Multi-Layer Resin Boards
For smartphones and other sophisticated mobile terminals
Closed a contract with AT&S regarding the joint development of technologies for next-generation circuit boards
Panasonic Electronic Devices Co., Ltd. (President: Toshiaki Kobayashi) is a leader in the development of high-density and multi-layer boards. The company's unique full-layer Interstitial Via Hole (IVH) structural multi-layer resin board technologies have been applied to its ALIVH business, which the company considers the most important business for the key devices that are essential in the evolution of sophisticated mobile terminals, such as smartphones. Panasonic has been accelerating the global development of this business.
Under these conditions, Panasonic has deployed the ALIVH series and are expanding the product lineup to meet a wide variety of needs in the smartphone and sophisticated mobile terminal market. In February 2011, the company reached an agreement with AT&S Company, Europe's largest circuit board manufacturer, to license the ALIVH technologies. Panasonic also closed a contract with AT&S regarding the joint development of technologies for next-generation circuit boards.
1. Enhancing the Any Layer Interstitial Via Hole (ALIVH) lineup
What is ALIVH?
ALIVH is a multi-layer resin board that was developed and commercialized by Panasonic, which also created the world's first full-layer IVH structure. In October 1996, the company was incorporated in a mobile phone manufactured by Matsushita Electric Industrial Co., Ltd. (currently Panasonic corporation). This mobile phone was the first in the industry to weigh 100 g or less and have a volume of 100 cc or less. Since then, ALIVH applications have since expanded from Japanese mobile phones to overseas mobile phones. As of the end of March 2011, more than 4 hundred million mobile phones incorporating Panasonic ALIVH boards have been shipped globally.
Current status of ALIVH
In the global mobile terminal market, smartphones have rapidly replaced mainstream general mobile phones. Based on the start of LTE services and the legal distribution of electronic books, demand in this market is expected to grow rapidly. These smartphones require high-density multi-layer circuit boards that can process large volumes of data at high speed.
Under these circumstances, attention is now focusing on the ALIVH as a key device, and since the start of mass production in 1996, the business has expanded as mobile phones have advanced.
Features of ALIVH
- Superior high-density and multi-layer mounting characteristics
- Helps reduce production lead times
- Helps reduce prototype production lead times
- Provides excellent design flexibility and facilitates circuit design
The ALIVH series contributes to the further development of smartphones and sophisticated mobile terminals.
||Features and product lineup
||Full-layer IVH structure motherboards with superior high-density, multi-layers, and thinness
- Ten-layer motherboards with line/space widths (trace width/interval) of 50/50 micrometers are in mass production. Twelve-layer motherboards are under development.
- Mobile phones
||Extremely strong and rugged motherboards
- Products with layered plating on the surface of ALIVH-G and are compatible with build-up boards. Line/space widths (trace width/interval) of built-up layer: 50/50 micrometers. Twelve-layer motherboards are in mass production.
- Mobile phones
||Boards for semiconductor packages or modules
- Small size and low profile help improve mounting characteristics. Boards with line/space widths (trace width/interval) of 40/40 micrometers are in mass production. Boards with line/space widths (trace width/ interval) of 20/20 micrometers are under development.
- Semiconductor packages(POP or MCM)
- RF modules
- Camera modules
||Boards with cavity (dent) structures on all-layer IVH for semiconductor packages
- Low-profile mounting boards, with components mounted in cavity section, ensure ultra compact modules. Boards with line/space widths (trace width/interval) of 50/50 micrometers are in mass production; motherboards are under development.
- RF modules
- Camera modules
|Flex boards with all-layer IVH structure and polyimide-film base material
- Thin, lightweight, and flexible. All-layer IVH structure can be applied, unlike with flexible printed circuit boards (FPC). They will allow the mounting space to be effectively used on mobile equipment, etc. The line/space width (trace width/interval) is 50/50 micrometers.
- Mother boards for mobile terminals
- Module boards
2. Global strategy: Exchanged a contract for joint development of technologies for next-generation circuit boards
Since the start of mass production in 1996, Panasonic has expanded the ALIVH business in line with the development of mobile phones. To further accelerate the global development of ALIVH, the company reached an agreement in February 2011 with AT&S Company, Europe's largest circuit board manufacturer (headquarters: Reoben, Austria; CEO: Andreas Gerstenmayer), to license the ALIVH technologies. The two companies will collaborate in the development of technologies related to next-generation boards.|
Exchanged a contract regarding joint development of technologies for next-generation circuit boards
In a ceremony held at the AT&S Shanghai Plant on April 7, 2011, Panasonic and AT&S signed a contract for the joint development of technologies for next-generation circuit boards. Andreas Gerstenmayer, CEO of AT&S, and Toshiaki Kobayashi, President of Panasonic Electronic Devices, attended the ceremony. The joint agreement is expected to expand the business in the smartphone and sophisticated mobile terminal market.
3. Development of PR for ALIVH
ALIVH featured on Panasonic's website
The website has a special corner for introducing leading-edge technologies. On April 25, this corner featured ALIVH. We introduce the values that can be provided to people engaged in product development, including the ALIVH core technologies, their superiority, and their application to more efficient design and development. The descriptions of ALIVH, including the thin, lightweight, and flexible ALIVH-F, are accompanied by easy-to-understand videos. This content is provided as a tool for better understanding the ALIVH business.
Panasonic : http://panasonic.net/ped/
ALIVH : http://panasonic.net/ped/r-and-d/approach/sp02/index.html
Exhibiting in the JPCA show
Panasonic will exhibit its products, including the ALIVH series, at the 41st International Electronic Circuit Exhibition, JPCA Show 2011, to be held at the Tokyo Big Sight from June 1 to 3, 2011. We hope to see you there.
JPCA : http://www.jpcashow.com/show2011/English/