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Unparalleled efficient compound resin has been achieved by high level of
material compound technology.

[ Metal-Substitute, Precision Molding Grade ]
Superior precise molding ability is performed by the low shrinkage rate and high fluidity.
By anisotropy relief of molding, the plane degree and the truth disc degree are improved and the warp is prevented.
[ Sliding and Abrasion-resistant Resin Grade ]
Low friction coefficient was achieved by the superior surface smoothness.
Abrasion-resistant ability is much improved by compound of "Pana-Tetra".
[ Electrification prevention, Conductive Resin Grade ]
High level of stable electrification prevention and conductivity.
Superior static electricity diffusion performance.

| Function | Grade | Base Resin | Features | Use example |
|---|---|---|---|---|
| Metal-Substitute, Precision Molding Resin |
MD15S | PPS | High rigidity / Size stability / Heatproof | Optical pickup for CD |
| MD102 | PPS | High rigidity / Low specific gravity / Conductivity / Heatproof |
Gear pump | |
| MD401C | PPS | High rigidity / High Sliding / Conductivity / Heatproof |
Audio tape head holder | |
| 77110L | LCP | High rigidity / Low specific gravity / Low shrinkage / Heatproof |
Lens holder for DVD | |
| ZE17201 | LCP | High rigidity / Size stability / High Sliding / Heatproof |
Optical pickup for MD | |
| Sliding and Abrasion-resistant Resin | MO10B | POM | High Sliding / Abrasion resistance | Precise gear |
| Electrification prevention, Conductive Resin | MP20A | PP | Conductivity / Size stability [Carbon compound materials] |
Tray for IC |
| MB10A | ABS | Electrification prevention / Extrusion processing [ Non-carbon materials] |
Tray for liquid crystal | |
| MB10AN | ABS | Electrification prevention / Extrusion processing [Non-carbon materials] |
Tray for liquid crystal | |
| ME41 | Modified PPE | Conductivity / Heatproof [Carbon compound materials] |
Tray for IC |
