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Global Home Business > Industrial Devices > Products > Materials > Functional Filler/Compound Resin Pellet,etc > Pana-Tetra Compound Resin

Amtec Co.,Ltd.

Pana-Tetra Compound Resin

Efficient compound resin

Unparalleled efficient compound resin has been achieved by high level of
material compound technology.

characteristic

[ Metal-Substitute, Precision Molding Grade ]
Superior precise molding ability is performed by the low shrinkage rate and high fluidity.
By anisotropy relief of molding, the plane degree and the truth disc degree are improved and the warp is prevented.

[ Sliding and Abrasion-resistant Resin Grade ]
Low friction coefficient was achieved by the superior surface smoothness.
Abrasion-resistant ability is much improved by compound of "Pana-Tetra".

[ Electrification prevention, Conductive Resin Grade ]
High level of stable electrification prevention and conductivity.
Superior static electricity diffusion performance.

[ Electromagnetic Radiation Shield Resin Grade ]
Excellent shield by adoption of special conductive filler.
Steady "mold processability and molded product's surface condition".

Grades

Pana-Tetra Compound Resin [ Grades & Features ]
Function Grade Base Resin Features Use example
Metal-Substitute,
Precision Molding
MD15S PPS High rigidity / Size stability / Heatproof Optical pickup for CD
MD102 PPS High rigidity / Low specific gravity /
Conductivity / Heatproof
Gear pump
MD401C PPS High rigidity / High Sliding /
Conductivity / Heatproof
Audio tape head holder
77110L LCP High rigidity / Low specific gravity /
Low shrinkage / Heatproof
Lens holder for DVD
ZE17201 LCP High rigidity / Size stability /
High Sliding / Heatproof
Optical pickup for MD
Sliding and Abrasion-resistant MO10B POM High Sliding / Abrasion resistance Precise gear
MN20K66 PA High Sliding / Abrasion resistance Precise gear
Electrification prevention, Conductive MP20A PP Conductivity / Size stability
[Carbon compound materials]
Tray for IC
MB10A ABS Electrification prevention / Extrusion processing
[ Non-carbon materials]
Tray for liquid crystal
MB10AN ABS Electrification prevention / Extrusion processing
[Non-carbon materials]
Tray for liquid crystal
ME41 Modified PPE Conductivity / Heatproof
[Carbon compound materials]
Tray for IC

MPC10-2
PC Conductivity / Heatproof
[Carbon fiber compound]
Tray for IC
Electromagnetic Radiation Shield EC-100 ABS EMI Shield / Metal-Substitute
[Carbon fiber Compound]
Shielding Case
EC-400 ABS/PC High Sliding / Metal-Substitute
[Carbon fiber Compound]/td>
Shielding Case

Specifications

item Metal-substitute, Precision molding grade
-> PPS , LCP , PEEK
item Electrification, Conductive resin grade
-> PP , PS , ABS , PBT , PPS
item Sliding and abration-Resistant Resin Grade
-> POM , PA , ABS , PPS
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