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    Amtec Co.,Ltd.

    Pana-Tetra Compound Resin

    Efficient compound resin

    Unparalleled efficient compound resin has been achieved by high level of
    material compound technology.

    characteristic

    [ Metal-Substitute, Precision Molding Grade ]
    Superior precise molding ability is performed by the low shrinkage rate and high fluidity.
    By anisotropy relief of molding, the plane degree and the truth disc degree are improved and the warp is prevented.

    [ Sliding and Abrasion-resistant Resin Grade ]
    Low friction coefficient was achieved by the superior surface smoothness.
    Abrasion-resistant ability is much improved by compound of "Pana-Tetra".

    [ Electrification prevention, Conductive Resin Grade ]
    High level of stable electrification prevention and conductivity.
    Superior static electricity diffusion performance.

    Grades

    Pana-Tetra Compound Resin [ Grades & Features ]
    Function Grade Base Resin Features Use example
    Metal-Substitute,
    Precision Molding Resin
    MD15S PPS High rigidity / Size stability / Heatproof Optical pickup for CD
    MD102 PPS High rigidity / Low specific gravity /
    Conductivity / Heatproof
    Gear pump
    MD401C PPS High rigidity / High Sliding /
    Conductivity / Heatproof
    Audio tape head holder
    77110L LCP High rigidity / Low specific gravity /
    Low shrinkage / Heatproof
    Lens holder for DVD
    ZE17201 LCP High rigidity / Size stability /
    High Sliding / Heatproof
    Optical pickup for MD
    Sliding and Abrasion-resistant Resin MO10B POM High Sliding / Abrasion resistance Precise gear
    Electrification prevention, Conductive Resin MP20A PP Conductivity / Size stability
    [Carbon compound materials]
    Tray for IC
    MB10A ABS Electrification prevention / Extrusion processing
    [ Non-carbon materials]
    Tray for liquid crystal
    MB10AN ABS Electrification prevention / Extrusion processing
    [Non-carbon materials]
    Tray for liquid crystal
    ME41 Modified PPE Conductivity / Heatproof
    [Carbon compound materials]
    Tray for IC

    Specifications

    item Metal-substitute, Precision molding grade
    -> PPS , LCP , PEEK
    item Electrification, Conductive resin grade
    -> PP , PS , ABS , PBT , PPS
    item Sliding and abration-Resistant Resin Grade
    -> POM , PA , ABS , PPS