Exhibition

International LED & OLED EXPO 2015 (Korea)(Closed : Thank you for joining our Exhibition.)

  • Official web Site
  • Date : June 23 (Tue) - 26 (Fri), 2015
  • Place : KINTEX (Korea International Exhibition Center)
  • Exhibition Products
    • Thermosetting plastic molding compound for LED reflectors “FULL BRIGHT UP”
    • Thermoplastic molding compound for optical parts “FULL BRIGHT PP”

Guangzhou International Lighting Exhibition(Closed : Thank you for joining our Exhibition.)

  • Official web Site
  • Date : June 9 (Tue) - 12 (Fri), 2015
  • Place : China Import and Export Fair Complex
  • Exhibition Products
    • High thermal dissipation circuit board materials “ECOOLseries”
    • Glass composite copper clad laminates “CEM-3”
    • Thermosetting plastic molding-materials for LED reflectors “FULL BRIGHT”
    • Other LED related products

JPCA Show 2015(Closed : Thank you for joining our Exhibition.)

  • Official web Site
  • Date : June 4 (Wed) - 6 (Fri)
  • Time : 10:00 - 17:00
  • Place : Tokyo Big Sight East 2 Hall 2E-30
  • Exhibition Product

    ■Circuit Board Materials

    Solution Exhibition Product Detailed data
    THINNER Halogen-free IC substrate materials MEGTRON GX series PDF filePDF:2.9MB
    Flexible Circuit Board Materials FELIOS series PDF filePDF:1.5MB
    Low Dk Halogen-free multi-layer circuit board materials PDF filePDF:2.1MB
    HIGH-SPEED Low Dk . Low Df and High Tg Multi-layer Circuit Board Materials MEGTRON series PDF filePDF:2.2MB
    Flexible Circuit Board Materials FELIOS LCP PDF filePDF:1.1MB
    HEAT High heat resistance high reliability Multi-layer Circuit Board Materials HIPER series PDF filePDF:2.2MB
    High Thermal Conductive Circuit Board Materials ECOOL series PDF filePDF:2.5MB
    High Thermal Conductive Insulation Sheet

    ■MID Solution

    • MIPTEC (Microscopic Integrated Processing Technology)
    • LDS (Laser Direct Structuring)

ECTC 2015(Closed : Thank you for joining our Exhibition.)

6th Film Tech Japan (Highly-functional Film Expo)(Closed : Thank you for joining our Exhibition.)

DESIGN CON 2015(Closed : Thank you for joining our Exhibition.)

PWB EXPO 2015(Closed : Thank you for joining our Exhibition.)

AUTOMOTIVE ENGINEERING EXPOSITION 2014(Closed : Thank you for joining our Exhibition.)

  • Official web Site
  • Date : December 11 (Thu) - 12 (Fri), 2014
  • Place : Nagoya Internarional Exhibition Hall, Japan
  • Exhibition Product :
    • High heat resistance phenolic molding compounds for automotive components
    • High heat dissipation unsaturated polyester resin molding compounds for automotive components
    • Long-term reliable PBT molding compounds for automotive components
    • Light diffusion/reflection PP molding compounds for LED (optical parts) FULL BRIGHT PP
    • Semiconductor encapsulation materials ECOM SuperFine, ECOM E
    • Liquid encapsulant for IC package ECOM FineFlow
    • High thermal conductive rubber sheet TIM

2014 LED EXPO 2014 (Korea)(Closed : Thank you for joining our Exhibition.)

  • Official web Site
  • Date : June 24 (Tue) - 27 (Fri)
  • Place : KINTEX (Korea International Exhibition Center)
  • Exhibition Product :
    • Plastic molding material for LED reflector / optical parts
      “FULL BRIGHT” series

2014 LED Lighting Taiwan(Closed : Thank you for joining our Exhibition.)

  • Official web Site
  • Date : June 17 (Tue) - 19 (Thu), 2014
  • Place : TWTC Nangang Exhibition Hall
  • Exhibition Product :
    • Plastic molding material for LED reflector / optical parts
      “FULL BRIGHT” series

2014 Guangzhou International Lighting Exhibition(Closed : Thank you for joining our Exhibition.)

  • Official web Site
  • Date : June 9 (Mon) - 12 (Thu), 2014
  • Place : China Import and Export Fair Complex
  • Exhibition Product :
    • High thermal dissipation circuit board materials

      “ECOOLseries”
    • Glass composite copper clad laminates

      “CEM-3”

JPCA Show 2014(Closed : Thank you for joining our Exhibition.)

  • Official web site
  • Date : June 4 (Wed) - 6 (Fri)
  • Time : 10:00 - 17:00
  • Place : Tokyo Big Sight East 2 Hall 2E-30
  • Exhibition Product
    Application Product
    For ICT infrastructure equipment Low Dk, Low Df and High Tg for Multi-layer Circuit Board Materials
    MEGTRON series, NEWMEGTRON 7
    For IC Substrates IC Substrate Materials MEGTRON GX series
    For Mobile products Flexible Circuit Board Materials FELIOS series
    Halogen-free series
    For LED Lighting
    For Automotive components
    High thermal conductive circuit board materials ECOOL series
    For Automotive components High Reliability Glass Epoxy Multi-layer Materials HIPER series
    For Touch panel Fine-wiring electrode film
    For various devices High thermal conductive rubber sheet
    Others MIPTEC 3D Packaging Technology
  • NPI Presentation
    Theme Low Dk . Low Df and High Tg for Multi-layer Circuit Board Materials “MEGTRON7”
    Date (Time) June 5 (Thu) 11:30 - 12:00
    Place East 6 Hall D Venue
    Theme For mobile products low Dk halogen-free multi-layer circuit board materials “R-A555”
    Date (Time) June 5 (Thu) 12:50 - 13:20
    Place East 6 Hall D Venue