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Multi-layer circuit board materials suitable to large capacity and high speed transmission of high frequency signal.
Low Dk/Df, high heat resistance, high reliability.
Circuit Board Materials
- Ultra-low transmission loss, highly heat-resistant multi-layer circuit board
materials
MEGTRON8
R-5795(U), R-5795(N) - Ultra-low transmission loss, highly heat-resistant multi-layer circuit board
materials
MEGTRON7
R-5785(N), R-5785(GN), R-5785(GE), R-5785(R) - Halogen-free ultra-low transmission loss multi-layer circuit board materials
Halogen-free MEGTRON6
R-5375(N), R-5375(E) - Ultra-low transmission loss, highly heat-resistant multi-layer circuit board
materials
MEGTRON6
R-5775(N),R-5775(K),R-5775(G),R-5775(S),R-5775(R) - Low transmission loss, highly heat-resistant multi-layer circuit board
materials
MEGTRON4S, MEGTRON4
R-5725S, R-5725 - Low transmission loss, highly heat-resistant multi-layer circuit board
materials
MEGTRON M
R-5735 - Halogen-free low transmission loss, highly heat-resistant multi-layer
circuit board materials
Halogen-free MEGTRON2
R-1577, R-1577E - Highly heat-resistant, low CTE multi-layer circuit board materials
(High-Tg type)
HIPER V
R-1755V
Video
Transmission loss performance Ranking in MEGTRON series
Line-up(Frequency dependence by Transmission loss)
General properties
| Item | Glass transition temp. (Tg) |
CTE z-axis | T288 (with copper) |
Dielectric constant (Dk) |
Dissipation factor (Df) |
Peel strength | ||
| α1 | α2 | 1GHz | 1oz (35μm) | |||||
| Test method | DSC | IPC-TM-650 2.4.24 |
IPC-TM-650 2.4.24.1 |
IPC-TM-650 2.5.5.9 |
IPC-TM-650 2.4.8 |
|||
| Condition | A | A | A | C-24/23/50 | A | |||
| Unit | °C | ppm/°C | min | － | kN/m | |||
| MEGTRON7 | R-5785(N) | 200 | 42 | 280 | >120 | 3.4 | 0.001 | 0.8 (Cu: H-VLP) |
| R-5785(GN) | 200 | 42 | 280 | >120 | 3.4 | 0.001 | 0.8 (Cu: H-VLP2) |
|
| R-5785(GE) | 200 | 42 | 280 | >120 | 3.6 | 0.002 | 0.8 (Cu: H-VLP2) |
|
| R-5785(R) | 200 | 42 | 280 | >120 | 3.4 | 0.001 | 0.8*² (Cu: Buried Resistor) |
|
| Halogen-free MEGTRON6 |
R-5375(N) | 250*¹ | 39 | 200 | >120 | 3.4 | 0.001 | 0.6 (Cu: H-VLP2) |
| R-5375(E) | 250*¹ | 39 | 200 | >120 | 3.7 | 0.002 | 0.6 (Cu: H-VLP2) |
|
| MEGTRON6 | R-5775(N) | 185 | 45 | 260 | >120 | 3.4 | 0.002 | 0.8 (Cu: H-VLP) |
| R-5775(K) R-5775(G) |
185 | 45 | 260 | >120 | 3.7 | 0.002 | 0.8 (Cu: H-VLP) |
|
| R-5775(S) | 185 | 45 | 260 | >120 | 3.4 | 0.002 | 0.8*² (Cu: Buried Resistor) |
|
| R-5775(R) | 185 | 45 | 260 | >120 | 3.7 | 0.002 | 0.8*² (Cu: Buried Resistor) |
|
| MEGTRON4 | R-5725 | 176 | 35 | 265 | 30 | 3.8 | 0.005 | 1.1 (Cu: RT) |
| MEGTRON4S | R-5725S | 200 | 32 | 250 | 50 | 3.8 | 0.005 | 1.3 (Cu: RT) |
| MEGTRON M | R-5735 | 195 | 31 | 240 | 35 | 3.9 | 0.005 | 1.2 (Cu: RT) |
| MEGTRON2 | R-1577 | 170 | 34 | 200 | 25 | 4.1 | 0.010 | 1.3 (Cu: ST) |
| HIPER V | R-1755V | 173 | 44 | 255 | 20 | 4.4 | 0.016 | 1.5 (Cu: ST) |
The sample thickness of MEGTRON7, MEGTRON6 and Halogen-free MEGTRON6 is 0.75mm. The sample thickness of other part number is 0.8mm.
*1 Test method: DMA
*2 Buried Resistor Copper Foil 1/2oz (18μm)
Our Halogen-free materials are based on JPCA-ES-01-2003 standard and others.
Contain; Chlorine:≤0.09wt%(900ppm), Bromine:≤0.09wt%(900ppm),
Chlorine+Bromine:≤0.15wt%(1500ppm)
The above data are typical values and not guaranteed values.
