[Notification of CAD Data Download Issue]
We regret to inform you that we are currently experiencing issues with downloading CAD data for some products.
We are investigating the cause of this problem. We apologize for any inconvenience this may cause and appreciate your understanding.
Business > Industrial Devices > Automation Controls Top > Components & Devices > Connectors > Narrow Pitch RF Connectors > RF4(0.35mm pitch) > Rating/Performance
Compatible with 5G Millimeter-wave Antenna Modules. Excellent EMI/SI performance.
・For 5G Millimeter-wave Antenna/
UWB (Ultra Wide Band) Antenna
・Connection between antenna module to
main board
|
Item | Specifications | Conditions | |
---|---|---|---|
Electrical characteristics |
Rated current | Max. 0.3 A / pin contact x 6 pin contacts Max. 1.0 A / pin contact x 2 pin contacts (2 pin contacts other than high frequency signal contacts) |
|
Rated voltage | 30 V AC, DC | ||
Dielectric strength | 150 V AC for 1 minute | Detection current: 1 mA | |
Insulation resistance | Min. 1000 MΩ (Initial stage) | Using 250 V DC megger (1 minute) | |
Contact resistance | Max. 90 mΩ | According to the method of JIS C 5402 (Current: 1 mA) |
|
Frequency | DC to 15 GHz | ||
V.S.W.R | DC to 3 GHz: Max. 1.2 3 to 6 GHz: Max. 1.4 6 to 12 GHz: Max. 1.5 12 to 15 GHz: Max. 2.0 |
||
Insertion loss | DC to 10 GHz: Max. 0.30 dB 10 to 15 GHz: Max. 0.50 dB |
||
Isolation | DC to 10 GHz: Min. 45 dB 10 to 15 GHz: Min. 35 dB |
||
Mechanical characteristics |
Composite insertion force | Max. 50 N (Initial stage) | |
Composite removal force | 5 to 40 N (Initial stage) | ||
Environmental characteristics |
Ambient temperature (Operating temperature) |
-55 to +85°C | No icing or condensation Include the calorification from the connector |
Storage temperature | -55 to +85°C (Products only) -40 to +50°C (Packaging structure) |
No icing or condensation | |
Soldering heat resistance | The initial specification must be satisfied electrically and mechanically | Max. peak temperature of 260°C Infrared reflow soldering (PC board surface temperature near connector terminals ) |
|
Thermal shock resistance (header and socket mated) |
After 5 cycles Insulation resistance: Min. 100 MΩ Contact resistance : Max. 90 mΩ |
||
Humidity resistance (header and socket mated) |
After 120 hours Insulation resistance: Min. 100 MΩ Contact resistance: Max. 90 mΩ |
IEC60068-2-78 Temperature: 40±2°C Humidity: 90 to 95% RH |
|
Salt water spray resistance (header and socket mated) |
After 24 hours Insulation resistance: Min. 100 MΩ Contact resistance: Max. 90 mΩ |
IEC60068-2-11 Temperature: 35±2°C Salt water concentration: 5±1% |
|
H2S resistance (header and socket mated) |
After 48 hours Contact resistance: Max. 90 mΩ |
Temperature: 40±2°C Gas concentration: 3±1 ppm Humidity: 75 to 80% RH |
|
Lifetime characteristics |
Insertion and removal life | Mechanical life: 10 times Contact resistance: Max. 90 mΩ Composite removal force: 5 to 40 N |
Repeated insertion and removal cycles of max. 200 times/hour |
Unit weight | 6 contacts Soket: 0.010 g Header: 0.006 g |
Part name | Material | Surface treatment |
---|---|---|
Molded portion | LCP resin (UL94V-0) | - |
Contact and Post | Copper alloy | Contact portion (main) : Au plating (Min. 0.1 μm) over nickel Terminal portion: Au plating over nickel (except for top of the terminal) Ground terminal: Au plating over nickel (except for top of the terminal) |
|
Requests to customers (Automation Control Components & Industrial Device) [Excluding specific product]
Requests to customers (Automation Control Components & Industrial Device) [For specific product]
Requests to customers (FA Sensors & Components [Excluding motors])
Requests to customers (Dedicated to industrial motors)